WMSIC Electronic Components

ETA ETA5055V250DS2F

ModelETA5055V250DS2F
PackageSOT-23-5
BrandETA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ETA ETA5055V250DS2F
Type
ETA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ETA
Electronic Component
ETA5055V250DS2F
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.06g
Electronic Component
1
Features
Output
Electronic Component
BM0259748624
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
2.5V
Output Current
500mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ETA5055V250DS2F 产品概述

一、产品简介

ETA5055V250DS2F 是钰泰(ETA)推出的一款固定输出线性低压差稳压器(LDO),输出电压为 2.5V、最大输出电流 500mA。器件采用 SOT-23-5 小封装,适合空间受限的便携或嵌入式应用。该器件集成了开/关使能、短路保护与过热保护,在保证稳定输出的同时具备良好的可靠性和系统保护能力。

二、主要参数

  • 输出类型:固定(2.5V)
  • 工作电压(最大输入):5.5V
  • 最大输出电流:500mA
  • 电源纹波抑制比(PSRR):94dB
  • 静态电流(Iq):典型 4.5µA
  • 工作温度范围:-40°C ~ +85°C(Ta)
  • 输出极性:正极输出
  • 输出通道数:1 通道
  • 保护特性:短路保护、过热保护(热关断)
  • 使能功能:带使能脚,可外部控制输出开关
  • 封装:SOT-23-5

三、性能特点

  • 低静态电流:典型静态电流仅 4.5µA,适合对待机功耗敏感的电池供电系统。
  • 高 PSRR:高达 94dB 的电源纹波抑制能力,有利于抑制上游开关电源带来的噪声,改善模拟/射频电路的供电纯净度。
  • 保护完善:内置短路限制与热关断机制,可在异常工作状态下保护器件与负载安全。
  • 使能控制:使能脚提供外部电平控制功能,便于系统电源管理和电源序列控制。
  • 小尺寸封装:SOT-23-5 封装便于在体积受限的 PCB 上布局。

四、应用场景

  • 电池供电的便携设备与消费电子(如便携仪表、可穿戴设备)
  • 对电源噪声敏感的模拟/音频前端与传感器供电
  • 嵌入式控制系统的单通道稳压电源
  • 需要低待机功耗、并具备硬件保护的工业电子模块

五、典型电路与使用建议

  • 输入/输出电容:为确保稳定性与瞬态响应,建议在输入端放置至少 1µF 低 ESR 陶瓷电容,输出端建议使用 10µF(或更高)的低 ESR 陶瓷电容,且电容应尽量靠近器件引脚布置。
  • 使能脚:在不需要输出时将 EN 拉低以实现低功耗;EN 高电平时输出按照固定 2.5V 工作。注意 EN 电平范围需参照器件详细数据手册。
  • 布局注意:输入/输出电容及地线应短而宽,减小寄生电感与电阻,以获得最佳稳定性与噪声抑制效果。热量集中时适当增加铜箔面积以利散热。
  • 保护与可靠性:在高温或大电流工况下,器件可能进入热关断或限流工作,系统应考虑软启动或限流策略以避免频繁触发保护。

六、封装与热管理

  • 封装:SOT-23-5,适合紧凑 PCB 设计,但散热能力有限。对长时间接近 500mA 的高功耗工作,建议在 PCB 上留出足够的铜箔散热区域或采用多层板增加散热通道。
  • 温度范围:器件可在 -40°C 至 +85°C 环境下可靠工作,适用于大多数工业与消费级应用。

总结:ETA5055V250DS2F 以其低静态电流、高 PSRR、完整的保护功能和紧凑封装,适合对功耗、噪声及可靠性有较高要求的单通道稳压场合。更多电气特性、引脚定义和典型应用电路建议,请参考 ETA 官方数据手册与应用说明。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.