Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ETA ETA5055V300DS2F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ETA ETA5055V300DS2F
- Type
- ETA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ETA
- Electronic Component
- ETA5055V300DS2F
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.06g
- Electronic Component
- 1
- Features
- Output
- Electronic Component
- BM0259571105
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 5.5V
- Output
- Electronic Component
- Output Voltage
- 3V
- Output Current
- 500mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ETA5055V300DS2F 产品概述
一、产品简介
ETA5055V300DS2F是钰泰（ETA）推出的一款高性能固定输出线性稳压器（LDO），输出电压为3.0V，最大输出电流500mA。器件采用SOT-23-5小封装，集成过流保护、过热保护与使能控制，静态电流仅4.5μA，适合对功耗与空间有严格要求的便携与电池供电设备。
二、主要特点
- 固定输出：3.0V，输出极性为正极
- 最大工作电压：5.5V（输入端需在器件允许范围内工作）
- 输出电流：最大500mA，内置过流保护（OCP）
- 高PSRR：可达94dB，能有效抑制电源纹波与外部干扰
- 超低静态电流：Iq = 4.5μA，适合待机与低功耗场景
- 带使能（EN）引脚，支持外部使能/关断控制
- 过热保护（OTP），在过温时自动关闭并在温度恢复后重新上电
- 工作温度范围：-40℃ ~ +85℃
三、封装与引脚
采用SOT-23-5封装，5引脚设计利于小尺寸系统集成。常见应用引脚包括VIN、VOUT、GND与使能（EN），另有一脚为保留或内部功能引脚。封装小巧，便于移动终端与空间受限的PCBA布局。
四、电气特性与使用建议
- 输入电压需高于稳压输出并在器件允许的最大值以内；实际设计应预留足够差压以保证稳定输出。
- 负载瞬变响应、纹波抑制等性能优异，适合为MCU、传感器及射频前端提供稳压电源。
- 输出电容建议采用低ESR陶瓷电容并遵循厂商建议的容值与布局以确保稳定性与瞬态响应。
五、热设计与保护说明
线性稳压器的功耗由 (Vin - Vout) × Iout 决定，举例：当Vin=5V、Vout=3V且Iout=500mA时，功耗约为1W，SOT-23小封装对散热有限，需在PCB上增大铜箔面积、使用多层板与热沉/过孔以降低结温，避免长期热关断。
六、典型应用场景
适用于便携式设备、物联网节点、可穿戴设备、手持仪器、传感器电源与低功耗控制电路等场合，尤其在待机功耗要求严格且需要高PSRR的电源设计中表现优异。
七、选型要点与结论
选择ETA5055V300DS2F时，需确认输入电压范围、最大功耗与PCB散热能力满足应用需求，并按厂商推荐的输入/输出旁路电容与布局要求设计。凭借低静态电流、高PSRR及全面的保护特性，该器件是对尺寸、功耗与电源质量有较高要求应用的合适选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
