Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ETA ETA3458FSG
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ETA ETA3458FSG
- Type
- ETA
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ETA
- Electronic Component
- ETA3458FSG
- Electronic Component
- 1
- Package
- SOT-563
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0264227214
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 2.5V~5.5V
- Switching Frequency
- 1.5MHz~2.5MHz
- Electronic Component
- Electronic Component
- Output Voltage
- 600mV~5.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ETA3458FSG 产品概述
一、概述
ETA3458FSG 是钰泰（ETA）推出的一款高效降压型 DC-DC 开关稳压器，采用微型 SOT-563 封装，适合空间受限的便携式和嵌入式系统。器件输入电压范围为 2.5V 至 5.5V，输出电压可调（0.6V 至 VIN），最大输出电流可达 3A。器件内置功率开关并采用同步整流，配合自适应 COT 控制，兼顾瞬态响应与高效率。
二、主要特性
- 输入电压：2.5V ~ 5.5V
- 输出电压：0.6V ~ VIN（可调）
- 输出电流：最高 3A
- 开关频率：1.5MHz ~ 2.5MHz（典型以 2MHz 运行）
- 拓扑：降压、同步整流、内置开关管
- 保护功能：逐波限流、过流保护、打嗝限流（hiccup）、短路保护、热关断
- 软启动：内部软启动以限制浪涌电流
- 工作温度：-40°C ~ +125°C (TJ)
- 封装：SOT-563（微型封装）
三、产品优势与应用
- 高频率（≈2MHz）允许使用小电感和小容值陶瓷电容，整体 BOM 体积小，适合体积受限的移动设备与 IoT 终端。
- 自适应 COT 控制带来快速瞬态响应，负载从轻到重切换平滑，且在不同线路/负载条件下可维持稳定工作频率。
- 内置同步整流和低 DCR 电感配合下效率高，发热低，有利于无风冷或被动散热设计。
- 广泛应用于便携式设备、电池供电系统、摄像头、模块电源和点对点电源管理（POL）。
四、典型设计建议
- 输出与输入侧优先选择低 ESR 陶瓷电容以降低纹波与噪声。
- 选用低 DCR、适配高开关频率的小体积功率电感以提升效率并缩小尺寸。
- PCB 布局应尽量减小开关回路与输入回路面积，确保热量可散出并保持稳定接地。
- 依据应用场景调整软启动与保护策略，利用打嗝限流改善短路恢复行为。
ETA3458FSG 以其小尺寸、高频率与完善保护特性，为低压高集成度电源设计提供了可靠且高效的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
