Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ETA ETA3418S2F
Configuration
1 options
Configuration
Option 68059
Availability on request
Technical data
Product details
19
specifications
Core information
- Product name
- ETA ETA3418S2F
- Type
- ETA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ETA
- Electronic Component
- ETA3418S2F
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.061g
- Electronic Component
- 1
- Features
- EMI Optimization
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0226462305
- Operating Temperature
- 40℃~+85℃@(TA)
- Operating Voltage
- 2.6V~7V
- Switching Frequency
- 2.5MHz~3.2MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ETA3418S2F 产品概述
一、产品简介
ETA3418S2F 是钰泰（ETA）推出的一款高开关频率、同步整流的降压型（buck）DC-DC稳压器。器件内置功率开关，输入电压范围2.6V7V，可调输出0.6V7V，连续输出电流最高可达2.5A，工作温度范围-40℃+85℃(TA)。封装为SOT-23-5，开关频率高达2.5MHz3.2MHz，适合对体积和外部元件尺寸有严格要求的便携与嵌入式系统。
二、主要性能特点
- 同步整流，降低整流损耗，提高中高负载效率；
- 内置开关管，无需外置功率MOSFET，简化设计；
- 输出可调，参考电压为600mV，方便通过外部分压设定常见电压点；
- 超高开关频率（2.5MHz~3.2MHz），允许使用更小的电感与电容，缩小解决方案体积；
- 单通道输出，峰值输出电流/连续输出2.5A，适合中等功率供电需求。
三、典型应用场景
- 移动电源、便携设备的主/从降压电源；
- IoT 终端、无线通信模块、单板计算平台的核心电源；
- 显示与摄像模组、车载电子辅助电源（在符合温度与散热限制下）。
四、设计与选型建议
- 电感：建议选用磁粉或铁氧体、具备≥3A饱和电流能力的电感，典型值常用0.47µH~1.0µH，以兼顾纹波电流与体积；
- 输入/输出电容：使用低ESR陶瓷（X5R/X7R），输入端典型10µF22µF，输出端22µF100µF（根据纹波与稳定性优化）；
- 反馈网络：以0.6V参考计算分压比，选取高精度电阻以降低误差；
- EMI与效率权衡：高开关频率便于小型化，但会增加开关损耗与辐射，必要时在输入侧加共模/差模滤波并优化布线。
五、布局与散热注意事项
- VIN、GND与SW 引脚走线应尽可能短且宽，输入电容与芯片引脚紧邻放置；
- 采用完整地平面或充足回流区域，SOT-23-5 封装热阻较大，应限制功率耗散并在高热负载下评估降额；
- 若PCB多层，SW 节点附近可加过孔与地平面耦合以改善散热与EMI。
综上，ETA3418S2F 适合追求小体积、高集成度且需中等电流输出的便携与嵌入式电源方案。实际设计应在器件数据手册基础上，根据系统效率、热耗与EMI 要求选择外部元件并做版级验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
