Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603B104K500NT 是由 FH(风华)公司生产的一款多层陶瓷电容器(MLCC),其额定电压为 50V,电容值为 100nF,电容的容差为 ±10%。该电容采用 SMD0603 封装,具有良好的高温特性和优异的电气性能,广泛应用于多种电子设备和电路中。
0603B104K500NT 的封装尺寸为 0603(即 1.6mm x 0.8mm),是当前市场上常用的贴片封装之一,适合于现代微型和高密度的电子电路设计。该封装形式不仅具有较小的体积,还便于自动化生产和贴装,提高了生产效率和空间利用率。
电容值:100nF(纳法),适合用于高频滤波和耦合应用。
额定电压:50V,意味着它可以在该电压下安全工作,适合于中等电压应用。
温度特性:采用 X7R 介质,X7R 是一种陶瓷介质,具有良好的温度稳定性,适合于温度变化范围为 -55°C 到 +125°C 的应用场合。X7R 特性使得该电容在不同温度条件下,能保持相对稳定的电容值,适合于各种环境下使用。
容差:±10%,表明在实际应用中,电容值可能会在 90nF 到 110nF 之间波动,这种容差足以满足一般电子电路的要求。
0603B104K500NT 贴片电容因其优越的特性和封装形式,广泛应用于以下领域:
0603B104K500NT 贴片电容是一款性能优异、可靠性高且适合多种应用场合的电子元器件。无论是在追求小型化的消费电子,还是要求高性能的工业和通信设备中,这款电容都能满足设计工程师的多种需求,助力于创造出更高效、更可靠的电子产品。其品牌 FH(风华)在行业内享有良好的声誉,确保了产品质量和服务的可靠性。
通过选择 0603B104K500NT,用户能够充分利用其出色的性能特点,从而实现更优质的电路设计和更高的产品可靠性。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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