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FH 0805B102K500NT
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0805B102K500NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0805B102K500NT
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0257641632
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0805B102K500NT 贴片电容 (MLCC)
1. 产品定义
0805B102K500NT是一种表面贴装电容器（SMD），采用0805封装，符合MLCC（多层陶瓷电容器）的标准。此型号具备优越的电气特性和可靠性，广泛应用于高频电路和动态负载条件下。
2. 主要参数
- 封装类型: 0805
- 电压额定值: 50V
- 电容值: 1nF (纳法)
- 容差: ±10%
- 介质类型: X7R
- 工作温度范围: -55°C至+125°C
- 品牌: 风华（FH）
3. 封装与尺寸
0805封装（长度为2.0mm，宽度为1.25mm）是现今广泛使用的贴片式电容器封装，因其具有较小的尺寸和较大的电容密度，被广泛应用于各类消费电子、通信设备及工业模块中。0805封装的设计便于自动化贴装，提高了生产效率。
4. 电性能
0805B102K500NT的电压额定值为50V，使其能够在较高电压环境下稳定工作，适用于高电压配置。1nF的电容值使其特别适合用于滤波、耦合和去耦等应用。容差±10%则确保了电容器在实际使用中可提供稳定可靠的电性能，同时仍然满足设计需求。
5. 介质类型
该电容使用X7R介质，该类型电容具有良好的温度稳定性，适用于多种温度环境下的应用。X7R介质在-55°C至+125°C的温度范围内具有较小的电容值变化（通常在±15%以内），这是其受到广泛欢迎的原因之一。它适合用于需要遭受温度波动的严苛环境，提供稳定的电气性能。
6. 应用场景
0805B102K500NT贴片电容因其独特的性能特征，广泛应用于：
- 消费电子: 电视、手机、平板电脑等便携设备。
- 计算机: 主板、图形卡和其他外围设备中的电源管理。
- 通讯设备: 基站、路由器等通迅设备的信号耦合和滤波。
- 工业控制: 在控制器、传感器等各类工业模块中，作为去耦和滤波应用。
7. 性能优势
使用0805B102K500NT贴片电容能带来诸多优势：
- 高可靠性: MLCC电容具备长期的使用寿命和低故障率，适合对长期可靠性要求高的产品。
- 小体积: 0805封装使该元件在空间受限的设计中尤为合适，为其他元器件留出更多的设计余地。
- 良好的温度性能: X7R材料确保了在恶劣环境下的稳定工作，提供可靠的电气性能。
8. 结论
0805B102K500NT贴片电容（MLCC）集成了多层陶瓷电容器的优点，具有良好的电压和温度特性。它的设计考虑到了现代电子设备对小型化、高性能和高稳定性的需求，成为众多电子设备设计中不可或缺的组件。无论是在消费电子、通讯还是工业领域，该电容器都能为电路提供有效的电源管理解决方案，确保产品的高效和可靠运行。
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