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FH 0402B223K500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0402B223K500NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402B223K500NT
- Electronic Component
- 1
- Electronic Component
- 22nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0257283066
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B223K500NT 产品概述
一、概述
0402B223K500NT 为风华（FH）生产的多层陶瓷贴片电容（MLCC），额定电压 50V，名义容量 22nF（223），公差 ±10%（K），介质体系为 X7R，封装为 0402（公制 1005）。该器件适用于高密度贴片电路中常见的去耦、电源滤波与旁路等应用，兼顾体积微小与良好电气性能。
二、主要参数
- 容值：22nF（223）
- 精度：±10%（K）
- 额定电压：50V DC（500）
- 介质：X7R（工作温度范围 -55°C 至 +125°C，典型容值变化在 ±15% 范围内）
- 封装：0402（1005）表面贴装
- 类型：多层陶瓷电容（MLCC）
三、特性与优势
- 体积小、适合高密度布局，节省 PCB 面积。
- X7R 介质在宽温度范围内具有稳定的电容量，适用于一般用途的去耦与滤波。
- 额定 50V 能满足多数中低压应用需求，比常见的 16V/25V 器件有更大裕量。
- MLCC 本身 ESR 低、响应快，适合高速去耦和瞬态电流抑制。
四、典型应用
- 电源去耦与旁路（DC-DC 输出、线性稳压器输入/输出）。
- 高频滤波与阻抗匹配场合。
- 模拟信号通路的旁通/耦合（注意 X7R 属于 Class II，非精密容值用）。
- 手机、可穿戴、物联网模组、消费电子、汽车电子（非关键安全回路）等对体积和性能有要求的产品。
五、使用与装配建议
- 建议遵循风华或行业推荐的回流焊曲线（无铅回流峰值温度一般不超过 260°C）。
- 为降低机械应力导致的微裂纹风险，贴装时避免靠近板边或穿孔位置，合理设计焊盘尺寸与焊膏量。
- 高可靠性场合建议适度电压降额（例如工作电压 ≤ 额定电压的 80%）并留有余量。
- 存储与搬运时请保持原包装，防潮并避免强烈振动或冲击。
六、订购与包装信息
- 型号含义示例：0402（封装） B（系列） 223（22nF） K（±10%） 500（50V） NT（盘带包装 Tape & Reel）。
- 可按项目需求选择卷带包装数量，便于贴片机直接上料。
如需更详细的电气特性曲线、封装尺寸图或回流焊工艺建议，请提供采购数量或用途场景，我可协助查询并给出更精确的资料。
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