WMSIC Electronic Components

FH RC-01W472JT

ModelRC-01W472JT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-01W472JT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-01W472JT
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
4.7kΩ
Electronic Component
50
Electronic Component
BM0257321214
Operating Temperature
55℃~+125℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-01W472JT 产品概述

一、产品简介

RC-01W472JT 为风华(FH)品牌的贴片厚膜电阻,阻值为 4.7kΩ,精度 ±5%,额定功率 50mW,封装为 0201(超小型 SMT)。该器件适合密集布局、小型化电子产品中的信号、分压和偏置网络使用,工作温度范围 -55℃ 至 +125℃,温度系数为 ±200 ppm/℃。

二、主要技术参数

  • 电阻类型:厚膜电阻
  • 阻值:4.7kΩ
  • 阻值公差:±5%
  • 额定功率:50mW(室温)
  • 标称工作电压(厂方标称):25V
  • 温度系数(TCR):±200 ppm/℃
  • 工作温度:-55℃ ~ +125℃
  • 封装:0201(尺寸极小,适配超小型 PCB)

说明:根据电阻功率与阻值的关系,避免仅依据额定工作电压直接计算耗散功率。按照 P = V^2 / R 计算,若要不超过 50mW,理论上器件上的最大连续直流电压约为 sqrt(0.05×4700) ≈ 15.3V。因此在电路设计中应以功率限制或按较低电压工作为准,或进行必要的功率余量设计。

三、结构与封装特点

0201 封装体积极小,适合高密度贴片场合。厚膜工艺具有成本低、批量稳定性好的优点,但相对薄膜电阻在噪声、容差和老化性能上存在差异。该系列适合对体积与成本敏感、对精度要求不高(如±5%)的应用。

四、典型应用场景

  • 移动终端、可穿戴设备的分压、偏置网络
  • 信号链中作为拉/下拉电阻、上拉电阻
  • 低功耗电子产品的阻性元件(需注意功率裕量)
  • 各类小型化家电、智能传感器与物联网终端

五、选型与使用注意事项

  1. 功率裕量:0201 50mW 为标称值,长期可靠性建议留有额外裕量(例如工作功率不超过额定功率的 60%)。
  2. 电压限制:实际允许电压应以 P=V^2/R 为准,本件对 4.7kΩ 时最大连续电压约 15.3V;若电路需要更高电压或瞬态冲击,应改用更高功率或更大阻值的器件。
  3. 温度与漂移:±200 ppm/℃ 表示温度变化会引起阻值显著漂移,温度敏感设计应予以补偿或选择更低 TCR 的产品。
  4. 机械应力:超小封装对焊接、回流及机械应力敏感,焊接路径与 PCB pad 设计应遵循厂方推荐。

六、存储与焊接建议

  • 存储环境应防潮、防尘,建议按照厂家推荐的防潮等级和开封后使用期(MSL)管理。
  • 推荐采用标准 SMT 回流工艺,严格控制回流峰值温度与时间,避免过长高温暴露造成电阻参数漂移或裂纹。
  • 贴装时使用适当的真空吸嘴并降低机械压力,以免引起芯片破损。

七、可靠性与测试

常规可靠性试验包括温度循环、湿热试验、机械冲击与振动、寿命老化(功耗加速)等。设计时应参考具体应用的应力级别,必要时向供应商索取可靠性报告或样片做验证测试。

总结:RC-01W472JT 以其超小尺寸和成本优势适用于体积受限、功率需求低且对精度要求不高的应用场景。选型时应重点考虑功率与电压匹配、温度漂移及焊接/存储工艺,以保证长期可靠运行。

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