WMSIC Electronic Components

FH 0603B471K500NT

Model0603B471K500NT
Package0603
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0603B471K500NT
Type
FH
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0603B471K500NT
Electronic Component
1
Electronic Component
470pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM69414395
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:0603B471K500NT 贴片电容(MLCC)

产品基本信息

  • 产品名称:0603B471K500NT
  • 类型:多层陶瓷电容器(MLCC)
  • 额定电压:50V
  • 电容值:470pF
  • 电容公差:±10%
  • 介电材料:X7R
  • 封装形式:0603
  • 品牌:FH(风华)

一、产品介绍

0603B471K500NT是一款优质的多层陶瓷电容器,具有小型化、高性能和可靠性的特点。该产品采用SMD0603封装,适用于贴片焊接,在电路板设计中广泛应用,尤其是在对空间要求高的场合。其额定电压为50V,适合各种应用中对电压的承受要求。电容值为470pF,并且提供了±10%的公差,确保其在实际应用中的稳定性和可靠性。

二、技术指标

  • 电压特性:0603B471K500NT的额定电压为50V,这意味着它能够安全工作在最高50伏特的电压环境中。这对于处理常规电源电压的电路(如5V、12V及其倍数的电源)是非常理想的。
  • 电容值与精度:470pF的电容值使其非常适合用于高频电路和信号耦合,低电平信号的过滤,以及高频振荡电路的调谐。±10%的公差保证了其电气特性的稳定性,降低了在生产和应用过程中的不确定性。

三、介电材料

0603B471K500NT采用X7R介电材料,这是一种具有良好温度特性和电气性能的陶瓷材料。X7R的特点是:

  • 温度范围:适用温度范围一般为-55°C到+125°C,支持各种环境条件的应用。
  • 电压和频率特性:具有较好的电压稳定性和频率响应,适用于高频信号的耦合和去耦,能够有效减少电路中的噪声。

四、应用领域

0603B471K500NT广泛应用于多种电子设备和电路中:

  • 消费电子:如手机、平板电脑、电视等产品的电路板中,作为电源去耦电容、滤波电容以及信号耦合电容。
  • 工业设备:在工业自动化控制系统中,作为信号处理与功率管理的关键元件。
  • 通讯设备:在网络通讯、无线电以及信号传输设备中,作为信号传输和杂音抑制的重要组件。
  • 汽车电子:在现代汽车的电子控制单元(ECU)中,用于电源稳定和信号滤波,有助于提升系统的稳定性和抗干扰能力。

五、安装与焊接

0603B471K500NT采用SMD封装,适合表面贴装技术(SMT)。其贴装方式简单,焊接可以采用回流焊或波峰焊工艺,适合批量生产。为确保焊接质量,建议选择合适的焊接温度和时间,避免因过热而损坏陶瓷电容的特性。安装时也应注意其在电路板上的位置,确保不会干扰其他元器件的功能。

六、总结

0603B471K500NT贴片电容是一款高性能、可靠性强的多层陶瓷电容器,具有广泛的应用场景和良好的性能特征。适合用于多种高频电路和电子设备中,在现代电子产品设计中扮演着重要的角色。选择合适的电容器,能有效提高电路的整体性能,是实现高质量电子产品的关键之一。随着电子技术的不断发展,0603B471K500NT将继续满足市场对高效、紧凑元器件的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.