WMSIC Electronic Components

FH 0603B103J500NT

Model0603B103J500NT
Package0603
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0603B103J500NT
Type
FH
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0603B103J500NT
Electronic Component
1
Electronic Component
10nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0000001346
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:0603B103J500NT 贴片电容 (MLCC)

基本信息

  • 产品名称:0603B103J500NT
  • 类型:贴片陶瓷电容器 (Multi-layer Ceramic Capacitor, MLCC)
  • 额定电压:50V
  • 电容量:10nF (纳法拉)
  • 公差:±5%
  • 温度特性:X7R
  • 封装尺寸:0603 (英寸)

产品特点

0603B103J500NT 是由著名电子元器件制造商风华(FH)生产的高性能贴片电容器。其采用了多层陶瓷(MLCC)技术,具有体积小、容量大、性能稳定等特点,使其在各类电子产品中得到了广泛应用。接下来,我们将详细介绍该产品的各个方面。

封装与尺寸

0603 封装是指其尺寸为 0.06 英寸 × 0.03 英寸(约 1.5 mm × 0.75 mm)的贴片电容器。这种小型封装适合高密度的电路设计,能够有效节省PCB(印刷电路板)空间。0603封装的电容器相较于其他尺寸的电容器,如0805或0402,更加紧凑,便于在空间有限的现代电子设备中使用。

电气参数

  • 额定电压:该电容器的额定电压为 50V,意味着其在长时间工作时,能够承受高达50伏特的电压而不发生击穿。这一参数使0613B103J500NT能够在多种应用环境下稳定运行。
  • 电容量:其电容量为10nF,适用于频率较高的电路,并且可用于滤波、耦合和旁路等功能,在高频及高速信号处理电路中表现出色。
  • 公差:±5%的公差意味着该电容器能够提供相对稳定和精确的电容量,有效保证电路设计的性能。

温度特性

该电容器采用X7R温度特性,具有良好的温度稳定性。X7R电容器通常在-55°C到+125°C的温度范围内工作,不会因温度变化而产生太大容量波动。此外,相较于其它温度特性,例如X5R或Y5V,X7R在电容量和温度变化之间的稳定性更好,但可能在大电流及高温环境下存在一定电容值的下降。

应用领域

0603B103J500NT贴片电容器因其优良的电气特性和低温漂特性,广泛应用于以下几个领域:

  1. 消费电子:如手机、平板电脑以及其他便携式智能设备中,主要用作耦合、旁路及滤波电路。
  2. 工业设备:在机械、汽车电子、工控设备与自动化控制中广泛使用。
  3. 通信设备:在网络设备、基站和其他通信模块中应用于滤波和电源管理。
  4. 医疗设备:在医疗电子仪器中用于精准电源和信号处理。

总结

0603B103J500NT是一款高性能的贴片陶瓷电容器,凭借其紧凑的0603封装、高额定电压、适中的电容量、优良的温度特性以及较小的公差,该产品在如今的电子行业中犹如一匹黑马,能够满足各类电子设备对小型化、高性能电子元器件的需求。无论是在消费电子、工业自动化、通信设备还是医疗领域,这款电容器都能发挥出其重要的作用,确保电路稳定、可靠运行。选择0603B103J500NT,将为您的电子应用提供强有力的支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.