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FH 0201CG120J500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0201CG120J500NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201CG120J500NT
- Electronic Component
- 1
- Electronic Component
- 12pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 10
- Electronic Component
- BM0257283240
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201CG120J500NT产品概述
一、产品简介
FH（风华）0201CG120J500NT为超小型多层陶瓷贴片电容（MLCC），标称容值12pF，容差±5%（J），额定电压50V，介电温度特性为C0G（亦称NPO）。0201超微型封装尺寸（约0.6 × 0.3 mm）非常适合高密度表面贴装（SMD）应用，兼顾体积受限场景下的电气稳定性与低损耗特性。
二、主要特点
- 容值/精度：12pF ±5%，满足高精度配对与匹配需求。
- 介质特性：C0G/NPO 温漂极小、介电损耗低、线性好，适合对温度稳定性要求高的电路。
- 电气性能：低ESR、低ESL，具备较高自谐频率，适合高频及射频场合。
- 封装优势：0201体积极小，便于智能终端、可穿戴与射频前端等空间受限产品的布局。
- 环保与可靠性：遵循无铅、RoHS 要求，适配自动化贴装与回流焊工艺。
三、典型应用
- 射频前端匹配网络、耦合与去耦电路；
- 振荡器、滤波与定时电路中的高稳定性电容元件；
- 高速信号路径的阻抗调节与谐振单元；
- 手机、蓝牙/Wi‑Fi 模块、可穿戴设备、SRAM/ADC 前端的高频优化。
四、组装与可靠性建议
- 建议按厂家回流焊曲线进行回流，避免超出推荐峰值温度及滞留时间；
- 采用与0201匹配的焊盘与焊膏量，减少机械应力集中以降低裂纹风险；
- 对长期库存或潮湿环境的元件，按包装与存放要求进行预烘烤处理；
- 在高频关键电路中，注意器件布局与地平面回流以发挥低ESL优势。
五、封装与订购信息
该型号常见为盘带（tape-and-reel）供货，适配飞针与贴片机自动贴装。选型时请确认批次放电性能与实际电路频率特性，如需样品或更详细的可靠性与回流曲线，请联系风华或授权分销商获取完整数据手册与应用指导。
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