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FH RS-03L4R70FT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RS-03L4R70FT
- Type
- FH
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RS-03L4R70FT
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 4.7Ω
- Electronic Component
- 1
- Electronic Component
- BM0257366830
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±250ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RS-03L4R70FT 产品概述
一、产品简介
RS-03L4R70FT 为风华（FH）出品的贴片厚膜电阻，阻值 4.7Ω，精度 ±1%，额定功率 100mW，封装为常见的 0603（英制）尺寸。该器件采用厚膜工艺制造，适用于高密度表贴电路板设计，体积小、可靠性高，适合各类消费电子、通讯设备与工业控制产品中的信号与分流场合。
二、主要电气与环境参数
- 阻值：4.7Ω
- 精度：±1%
- 额定功率：100mW
- 工作电压：最大 50V
- 温度系数（TCR）：±250 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0603（贴片）
三、结构与性能特点
该系列为厚膜电阻，采用陶瓷基体与厚膜电阻膏印刷固化而成，具有良好的抗冲击性与焊接耐受性。±1% 的公差配合 ±250 ppm/℃ 的温度特性，可在温度变化环境中维持稳定的阻值表现。0603 小封装利于实现电路板的高密度布局并满足轻薄化要求。
四、典型应用场景
- 手机、平板等便携式电子设备的信号分流与限流
- 通信设备与网络终端中的电阻阵列应用
- 工业控制及测量仪器中的精密阻值需求场合
- PCB 原型与量产板上常规去耦、偏置、分压用途
五、使用与注意事项
- 额定功率 100mW 为在规定散热条件下的持续功率，实际应用中应考虑周围元件与 PCB 散热情况，避免超负荷使用。
- 工作电压不得超过 50V，以免引起击穿或异常发热。
- 在回流焊工艺中遵循合理的温度曲线，避免过长高温暴露影响可靠性。
- 对阻值精度与温漂有较高要求的电路，应评估长期稳定性并考虑配套检验。
六、封装、标识与选型建议
RS-03L4R70FT 采用 0603 表贴封装，标识以常规包装批次与阻值编码为主。选型时建议根据电路板空间、额定功率与允许温升来确定是否采用该型号；在需要更高功率或更低温漂的场合，可选择更大封装或金属膜/薄膜精密电阻替代。
如需进一步的可靠性数据（如温度循环、湿热、寿命测试）或样品与大货报价，可提供具体需求以便查核更详尽的规格书与库存信息。
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