Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
描述: 0603B105K500NT是一款标称电压为50V、静电容量为1μF、具有±10%电容公差的多层陶瓷电容(MLCC)。其采用0603封装,具有较小的尺寸和轻便的特性,适用于多种电子应用。
品牌: FH(风华)
封装类型: SMD0603
小型化设计: 0603封装使得该电容尺寸极小,便于在空间有限的电路板上进行应用。
良好的温度稳定性: 采用X7R介质,该电容在-55℃至+125℃的温度范围内能够保持较为稳定的电容值,适合多种温度环境下的工作。
适应性强: 具有50V的额定电压,可以在许多电子设备中广泛运用,尤其是在需要较高工作电压的环境中。
节能环保: 由于其无铅特性,0603B105K500NT符合RoHS标准,适合环保设计的设备使用。
0603B105K500NT贴片电容广泛应用于以下领域:
消费电子: 包括手机、平板电脑、笔记本电脑等设备,提供去耦功能和滤波效果。
工业设备: 在PLC(可编程逻辑控制器)、传感器以及远程设备中,用于信号稳定和噪声抑制。
通讯设备: 在基站、路由器等网络设备中,提供稳定的工作性能和高效的电能管理。
汽车电子: 用于车载电路中的去耦、滤波和信号调理,确保设备在高温和振动环境中的可靠性。
医疗设备: 由于其高稳定性和低损耗特性,适用于各种医疗监测和治疗设备中。
焊接注意事项: 鉴于0603封装元件的精细结构,建议使用适合的焊接设备和技巧,确保焊点整洁,避免高温造成的损坏。
存储条件: 存放于干燥、无尘的环境,以防潮气对电容性能的影响。推荐的存储温度为-40℃至+85℃。
电气特性测试: 在实际应用前,建议进行电气特性测试,确保电容在所预期的频率和温度条件下表现出稳定的电容值。
0603B105K500NT是一款性能稳定、应用广泛的小型多层陶瓷贴片电容。凭借其在高频、耐压及温度变化中的优异表现,它成为现代电子电路设计中不可或缺的电子元器件。风华的品牌保证了其质量可靠性,使其在设计时可大幅提升电子产品的性能与稳定性。通过合理应用0603B105K500NT,设计人员可以更好地满足市场对高效能、高可靠性电子产品的需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products