Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FH(风华)RC-02K49R9FT是一款针对高密度PCB设计、宽温环境应用的0402封装厚膜片式电阻,属于工业级常规精度电阻范畴,兼顾小型化、稳定性与成本优势,广泛适配消费电子、工业控制及汽车电子等领域的信号调理与偏置电路需求。
RC-02K49R9FT型号各字符对应明确:
该产品定位为小功率、高精度厚膜电阻,核心满足“高密度PCB+宽温环境+常规精度需求”,无需过度追求薄膜电阻的超高精度(如0.1%),平衡了性能与成本。
标称阻值49.9Ω,精度±1%(实际阻值范围49.401Ω~50.399Ω),符合E96系列1%精度规范,可满足多数电路对阻值偏差不敏感的信号调理(如分压、限流)需求,避免精度冗余导致的成本上升。
温度系数(TCR)±100ppm/℃,表示温度每变化1℃,阻值变化±0.01%。以25℃~125℃温差(100℃)为例,阻值变化量约49.9Ω×100×100e-6≈0.499Ω,恰好处于±1%精度范围内,保证宽温环境下电路性能稳定。
-55℃+155℃,覆盖工业级(-40+85℃)与汽车级(-55~+125℃)温度需求,可在极端低温(高原、寒带)或高温(发动机舱)环境下长期可靠工作。
尺寸1.0mm×0.5mm×0.3mm(典型),是贴片电阻高密度设计主流封装,可有效节省PCB面积,适配智能手机、智能穿戴、小型通信模块等空间苛刻的产品。
采用陶瓷基片+厚膜电阻浆料印刷+烧结+电极/保护层工艺:
结合参数特性,RC-02K49R9FT主要适用于:
该产品是中低端电子设备“小功率、高精度、宽温”场景的优选电阻,可有效降低系统成本并保证长期可靠性。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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