Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0603X225K160NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0603X225K160NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0603X225K160NT
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0263547925
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0603X225K160NT 贴片电容(MLCC)
一、产品基本信息
产品名称：0603X225K160NT
商品分类：贴片电容 (MLCC)
容值：2.2µF
材质（温度系数）：X5R
精度：±10%
额定电压：16V
品牌：FH（风华）
封装：0603
二、产品特性
0603X225K160NT是一款具有优良性能的多层陶瓷电容（MLCC），其特点包括：
紧凑封装：采用0603封装尺寸（1.6mm × 0.8mm），使其能够在空间有限的电路板上轻松适配，满足现代小型电子设备对于小型化和高密度设计的需求。
容值与精度：2.2µF的容值，配合±10%的精度，使得其在电路应用中能够提供可靠的滤波和旁路功能，保证电源的稳定性和传输信号的完整性。
温度特性：选用X5R材料作为介质，这种材料能够在-55℃到+85℃的广泛温度范围内保持良好的电容性能，并在一定湿度条件下也能保持稳定的电气特性，适用于不同环境下的电路应用。
额定电压：额定电压为16V，适用于低压电子电路，广泛应用于消费电子设备、工业设备和汽车电子等领域。
三、应用场景
0603X225K160NT贴片电容广泛应用于各类电路设计中，主要包括：
电源去耦和滤波：在电源端，通过去耦电容降低电源噪声，提升电源的稳定性；在信号传输线路上，通过过滤高频噪声以提高信号的清晰度。
耦合和旁路：在音频和射频行业，用于信号耦合和旁路，可以有效隔离不同电路模块，提高信号完整性。
高频电路：由于其低自谐振频率和良好的高频性能，0603X225K160NT电容非常适合用于高频电路，保证信号的高效传输。
汽车电子：在汽车的各种电子控制单元中，作为信号处理和电源管理的关键元器件，增强汽车电子产品的稳定性和安全性。
四、产品优势
高可靠性：采用先进的生产工艺和严格的质量控制，0603X225K160NT具有高稳定性和可靠性，适合长时间工作在多种环境下。
环保特性：符合RoHS指令，采用环保材料，有助于减少环境污染及对人体的危害。
良好的性能价格比：作为风华品牌的产品，0603X225K160NT以其优良的性能和合理的定价，为客户提供高性价比的选择。
五、总结
0603X225K160NT贴片电容（MLCC）凭借其紧凑的0603封装、稳定的容值和温度性能，广泛适应各类现代电子产品的需求，是电路设计中不可或缺的基本元件之一。无论是在消费电子、工业设备还是汽车电子应用中，0603X225K160NT都展现出了优异的性能和可靠性。随着电子产品的不断进步和发展，这款贴片电容将继续扮演着重要角色。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
