WMSIC Electronic Components

FH 0402CG220J500NT

Model0402CG220J500NT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0402CG220J500NT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0402CG220J500NT
Electronic Component
1
Electronic Component
22pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM69414932
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:0402CG220J500NT 贴片电容(MLCC)

一、基本信息

产品型号: 0402CG220J500NT
类型: 多层陶瓷电容(MLCC)
电压等级: 50V
容量: 22pF
公差: ±5%
温度特性: C0G(NP0)
封装尺寸: 0402 (1005 metric)
品牌: FH(风华)

二、产品特性

0402CG220J500NT 是一款高质量的多层陶瓷电容,专为高频应用及稳定性要求较高的电路设计而制造。它的容量为22皮法(pF),非常适合在各种电子产品中执行旁路和耦合功能。该元器件具有较高的耐压等级(50V),能够满足绝大多数消费电子和工业应用中的电压需求。

  1. 高稳定性: C0G(NP0)类电容具有极低的温度和电压系数,使其容量在环境温度变化或施加电压时保持稳定,是高频应用的理想选择。

  2. 紧凑设计: 0402封装尺寸(1.0mm x 0.5mm)使该电容器适合于空间受限的设计,例如手机、平板电脑及其他小型设备。

  3. 低损耗特性: C0G类型电容器具有出色的介电损耗性能,适用于高频电路,确保信号传输过程中最小的信号损失。

  4. 长寿命和可靠性: 采用陶瓷材料的多层设计,该电容器展现出优良的温度与湿度的适应性,能够确保长期稳定运行,极大地提升了产品的整体可靠性。

三、应用场景

0402CG220J500NT电容器广泛应用于多种电子设备中,特别是在对信号完整性及稳定性要求较高的领域。以下是该元器件的一些典型应用场景:

  1. 射频设备: 由于其良好的高频响应能力,该电容器非常适合用于射频电路,包括天线匹配、滤波器和振荡器等设计。

  2. 消费电子: 在手机、平板和智能穿戴设备等消费电子产品中,经常用于电源旁路、解耦和高频耦合电路中。

  3. 汽车电子: 随着汽车电子化程度的增加,该电容器适合用于汽车的控制模块和传感器电路,要求高稳定性和长寿命的场合尤为出色。

  4. 工业控制: 在工业自动化设备中,该电容器用于控制信号传递、运动控制系统及电源管理中,确保系统的高效运行。

四、结论

0402CG220J500NT 贴片电容以其卓越的电气性能和可靠的稳定性,是现代电子设计中不可或缺的重要元件。无论是在高频应用、消费电子还是工业控制领域,该电容器均展现出极佳的应用价值和广泛的适用性。随着科技的进步和产品的不断发展,采用此类高性能电容器将为设计工程师带来更多的创新空间和设计灵活性。选择FH品牌的0402CG220J500NT,您将为产品提供更加稳定和可靠的电气性能,为终端用户提供最佳的使用体验。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.