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FH 0603X105K100NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- FH 0603X105K100NT
- Type
- FH
- Minimum package
- 4000
Technical parameters
- Electronic Component
- FH
- Electronic Component
- 0603X105K100NT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0257284030
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603X105K100NT 产品概述
一、产品简介
0603X105K100NT 是风华（FH）生产的多层陶瓷贴片电容（MLCC），标称电容为 1.0 µF，公差 ±10%（K），额定电压 10 V，介质体系为 X5R，封装为 0603（公制 1608）。该系列面向表面贴装电路板的去耦、旁路与一般滤波应用，兼顾体积小与容值较高的需求。
二、主要性能与规格
- 电容：1.0 µF ±10%
- 额定电压：10 V DC
- 介质：X5R（工作温度范围典型为 -55°C 至 +85°C，温度导致电容变化在规定范围内）
- 封装：0603（约 1.6 × 0.8 mm）
- 包装：卷带（T&R）常见，便于贴片机领用
- 适用工艺：回流焊（建议按厂家回流曲线）
三、X5R 特性说明
X5R 为高介电常数陶瓷材料，能在较小封装内提供较大电容值，适合去耦和能量旁路。与 NP0/C0G 相比，X5R 的温度与频率稳定性一般较差：温度范围内电容允许有较大偏移，且在直流偏压（DC bias）条件下电容值会明显下降。设计时应预估在额定电压下的实际可用电容，并根据应用选择适当裕量。
四、典型应用场景
- 电源去耦与稳压器旁路（尤其在空间受限的移动设备、消费电子中）
- 电源滤波、瞬态抑制与稳态噪声滤除
- 高频旁路与信号链中非关键耦合点（考虑到介质的频率特性）
五、设计与使用建议
- DC Bias：X5R 在较高偏压下电容会下降，建议在设计中验证实际工作电压下的有效电容，关键电源节点可考虑更高额定电压或并联多只电容。
- 温度与老化：X5R 会随温度变化与时间老化，敏感电路应留裕量。
- 额定电压使用：尽量避免长期在额定电压下满额工作，适当降额可提升可靠性。
- 焊接工艺：遵循风华推荐的回流曲线，避免过冲温度与长时间高温，贴装前注意防潮封装保存。
- ESD 与机械应力：0603 尺寸较小但易受机械应力影响，贴装与维修时避免强力弯曲与冲击。
六、可靠性与测试
常见测试包括电容量与介质损耗（tanδ）、绝缘电阻、耐压与温度循环、湿热与焊接热冲击。风华产品通常有相应的可靠性验证报告，批量采购前可索取样品和加速寿命测试数据以确认在目标应用中的表现。
七、采购与替代
型号 0603X105K100NT 适用于需要 1 µF/10 V 的小尺寸解决方案。采购时注意确认包装方式与批次、出货检验报告（如 C of C）。如应用对温度或偏压稳定性要求更高，可考虑增加并联 NP0/C0G 或选用更高额定电压/更稳定的介质型号。
如需该料号的典型直流偏压曲线、ESR/ESL 数据或回流曲线，我可以进一步提供或协助查询风华的详细技术规格书。
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