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FH 0805B104K500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0805B104K500NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0805B104K500NT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.044g
- Electronic Component
- 1
- Electronic Component
- BM69414390
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0805B104K500NT 贴片电容（MLCC）
一、产品描述
0805B104K500NT是一款多层陶瓷电容（MLCC），其额定电压为50V，容量为100nF（0.1μF），误差范围为±10%。该电容采用0805封装形式，符合表面贴装技术（SMD），非常适合现代电子设备的紧凑设计需求。
二、规格参数
- 型号：0805B104K500NT
- 电容类型：多层陶瓷电容（MLCC）
- 额定电压：50V
- 电容值：100nF（0.1μF）
- 温度特性：X7R
- 温度范围：-55°C至+125°C
- 封装尺寸：0805（2.0mm x 1.25mm）
- 容差：±10%
- 品牌：风华（FH）
三、应用领域
0805B104K500NT广泛应用于各种电子设备中，包括：
- 消费电子：智能手机、平板电脑、便携式音响等。
- 计算机设备：主板、显卡、存储设备等。
- 工业电子：自动化设备、传感器、测量仪器等。
- 通讯设备：路由器、交换机、无线基站等。
- 汽车电子：仪表盘、车载娱乐系统、传感器模块等。
四、性能特点
高稳定性：由于X7R温度特性的设计，0805B104K500NT在不同温度和电压条件下，能够保持良好的电容值稳定性，适宜在多变的环境中使用。
小型化设计：0805封装尺寸小，可以更有效地节省PCB空间，提高设备的集成度，非常适合现代电子产品对小型化和轻量化的需求。
可靠性强：MLCC电容具备较高的抗电压和抗老化能力，可靠性较高，适合用于长期工作环境，无需频繁更换。
优良的性能：较高的耐压和低的串联电阻（ESR）特性，使其在高频应用中表现优异。
五、推荐使用注意事项
在使用0805B104K500NT时，需要注意以下几点，以确保电容的最佳性能和可靠性：
电压偏差：使用时应避免施加超过额定电压的电压，以防止损坏电容或发生击穿。
温度管理：尽量在推荐的温度范围内工作，稀释高温或低温对电容性能的影响。
安装方向：贴片电容通常是非极性的，但在安装时仍需确保焊接良好，以保证电容的接触不良。
PCB布局：在设计PCB时，建议保持电容与相关元器件之间的合理距离，以减少寄生电感和电阻对高频信号的影响。
六、结论
0805B104K500NT贴片电容是一款极具性能和可靠性的电子元器件，适用于广泛的应用场景。其优越的技术指标、出色的温度特性以及小巧的封装尺寸，为现代电子设备的设计提供了强有力的支持。选择风华品牌的0805B104K500NT，能够有效提升产品的整体性能与可靠性。无论是在高频应用还是高稳定性要求的环境中，0805B104K500NT都展现出其不可或缺的价值，是电子设计师的理想选择。
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