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FH 0402B105K6R3NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0402B105K6R3NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402B105K6R3NT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0263677009
- Electronic Component
- X7R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B105K6R3NT 贴片陶瓷电容（MLCC）产品概述
一、产品基本属性
0402B105K6R3NT是风华（FH）品牌推出的多层片式陶瓷电容（MLCC），型号编码直接对应核心参数：
- 封装：0402（英制0.04英寸×0.02英寸，公制1.0mm×0.5mm）；
- 容值编码：105（10×10⁵pF=1μF）；
- 精度等级：K（±10%）；
- 额定电压：6R3（6.3V直流额定电压）；
- 介质材质：X7R（陶瓷介质）。
产品采用贴片式设计，适配自动化SMT生产，无极性，安装灵活。
二、关键性能参数
- 容值与精度：标称容值1μF，精度±10%，满足多数电路对容值偏差的常规要求；
- 额定电压：直流6.3V，使用时需注意电压降额（如交流电路按有效值降额，避免过压失效）；
- 频率特性：MLCC结构赋予良好高频响应，适合信号耦合、滤波等高频场景；
- 损耗特性：X7R材质损耗较低（典型值<5%@1kHz），减少电路能量损耗。
三、温度特性与稳定性
X7R陶瓷介质的温度适用范围为**-55℃~+125℃**，此区间内容值变化控制在±15%以内，优于Y5V等低稳定度材质：
- 低温场景（如户外设备）：-55℃时容值偏差≤+15%；
- 高温场景（如充电设备内部）：+125℃时容值偏差≤-15%；
- 常温（25℃）下容值稳定，无明显漂移，适配宽温环境。
四、封装与工艺优势
0402封装具有超小体积（约1.0mm×0.5mm），适配高密度PCB设计（如智能手机、智能穿戴），核心工艺优势：
- 多层陶瓷叠层：通过叠层工艺平衡大容量与小体积，比电解电容更稳定、寿命更长；
- 无极性设计：无需区分正负极，安装无需额外判断，提升生产效率；
- 抗干扰性：陶瓷介质绝缘性好，可抑制电磁干扰（EMI），提升电路可靠性。
五、典型应用领域
该产品因体积小、容量适中、稳定性良好，广泛应用于：
- 消费电子：手机、平板、蓝牙耳机的电源滤波、音频耦合、射频信号滤波；
- 智能穿戴：智能手环、手表的传感器电路滤波、低功耗电路稳压；
- 工业控制：小型PLC、传感器模块的信号调理电路；
- 物联网设备：低功耗终端（如智能门锁、温湿度传感器）的电源管理；
- 汽车电子：车载辅助电路（如USB充电接口、中控小模块）的低压滤波（风华部分批次满足汽车级要求）。
六、品牌与可靠性保障
风华（FH）作为国内MLCC主流厂商，该产品具备可靠的量产保障：
- 环保合规：符合RoHS 2.0、REACH标准，无铅无镉；
- 可靠性测试：经过温度循环（-55℃+125℃，1000次）、湿度测试（85℃/85%RH，1000h）、振动测试（102000Hz，2g加速度）等严苛验证；
- 产能稳定：成熟生产线可保障批量订单交货周期，适合大规模量产应用。
该产品综合性能适配中低端电子设备的常规需求，是高密度PCB设计中常用的滤波/耦合元件。
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