WMSIC Electronic Components

FH CBG201209U601T

ModelCBG201209U601T
Package0805
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH CBG201209U601T
Type
FH
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
CBG201209U601T
Electronic Component
1
Package
0805
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.027g
Electronic Component
1
Channel Count
1
Electronic Component
BM0230044028
Current
300mA
@Frequency
600Ω@100MHz
Resistor(DCR)
350mΩ
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CBG201209U601T 产品概述

一、产品简介

CBG201209U601T 为风华(FH)出品的单通道磁珠(0805 封装),主要用于对电源与信号线的高频噪声抑制。该器件在100MHz 时标称阻抗为600Ω,直流电阻(DCR)约为350mΩ,额定电流300mA,阻抗公差±25%。体积小、损耗低,适合表贴自动化生产。

二、主要参数

  • 型号:CBG201209U601T
  • 品牌:风华(FH)
  • 封装:0805(2012 公制尺寸)
  • 通道数:1
  • 直流电阻(DCR):350 mΩ
  • 阻抗:600 Ω @ 100 MHz(±25%)
  • 额定电流:300 mA
  • 阻抗公差:±25%

三、特性与优势

  • 高频阻抗高:在100MHz 附近提供显著抑制效果,适合抑制开关电源及数字电路产生的射频干扰。
  • 低直流损耗:350mΩ 的DCR 保证在几十至几百毫安工况下功耗和压降较小。
  • 小型封装:0805 适配高密度贴装,便于自动化SMT流程。
  • 单通道通用性强:可用于单一电源轨或信号线上做滤波/隔离。

四、典型应用场景

  • 手机、平板、便携设备的电源滤波(VCC、LDO 输入/输出)。
  • 数字电路、MCU 电源及信号线的EMI 抑制。
  • USB、HDMI 等接口线的共模/差模高频干扰控制。
  • 工业与消费电子的小电流直流电源滤波场合。

五、使用与选型建议

  • 电流裕量:额定300mA 为连续电流上限,若长时间或脉冲电流接近此值建议选用额定更高产品以避免过热或阻抗下降。
  • 频率匹配:若系统主要干扰频段偏离100MHz,参考阻抗曲线选择在目标频段有较高阻抗的型号。
  • DCR 考量:当电源压降要求严格时,应优先关注DCR 值以减少直流耗损。
  • 并联/串联:若需更高阻抗或更大电流,可并联或串联多个磁珠,但需考虑寄生及温升。

六、封装与可靠性注意

  • 焊接工艺:兼容常规回流焊工艺,建议按照IPC 焊接热衰减与预热曲线,避免过高峰值温度和过长停留时间。
  • PCB 布局:为降低寄生电感,尽量缩短器件两端的走线长度,并在靠近噪声源或受扰设备处布置。
  • 存储与防潮:遵循常规SMD 元件防潮包装要求,贴片前若包装打开请按需回流前烘烤。

七、测试与验证

  • 测试方法:常用网络分析仪测量阻抗频率响应(|Z| vs. f)和S 参数;直流测试测量DCR 与温升。
  • 验证重点:在目标工作电流与环境温度下验证阻抗是否满足抑噪要求以及是否有过热现象。

如需阻抗频率曲线、回流温度建议或量产包装信息,可提供进一步数据或联系风华授权经销商获取器件完整规格书。

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