Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH RC-02K4992FT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RC-02K4992FT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RC-02K4992FT
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.022g
- Electronic Component
- 49.9kΩ
- Electronic Component
- 50
- Electronic Component
- BM0229918803
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-02K4992FT 产品概述
一、产品简介
RC-02K4992FT 为风华（FH）系列贴片厚膜电阻，封装尺寸为 0402（约 1.0 mm × 0.5 mm），阻值 49.9 kΩ，公差 ±1%，额定功率 62.5 mW，额定工作电压 50 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55℃ ~ +155℃。该型号以小体积、高密度装配兼容性和稳定的阻值特性，适配消费电子与精密信号电路的低功率场景。
二、主要电气参数
- 阻值：49.9 kΩ
- 精度：±1%
- 额定功率：62.5 mW（贴片 0402 尺寸下的额定功耗）
- 最大工作电压：50 V
- 温度系数：±100 ppm/℃
- 工作温度：-55℃ 至 +155℃
- 制程：厚膜（适用于常规回流工艺与批量贴装）
三、性能特点
- 小型化封装（0402），利于高密度电路板设计与体积受限产品的布局优化。
- ±1% 精度与 49.9 kΩ 的阻值组合，适合对阻值稳定性有较高要求的分压、偏置与滤波网络。
- 厚膜工艺在成本与通用性能上具备竞争力，制造一致性良好。
- 宽温度范围与 ±100 ppm/℃ 的温漂特性，使器件在工业级温度环境下仍能保持可预测的阻值变化。
四、典型应用场景
- 模拟信号链的分压与偏置电路（ADC 前端、比较器网络）。
- 微控制器/逻辑电路的上拉、下拉与定时元件。
- 低功耗便携终端、物联网模组及消费类电子设备中的通用阻值需求。
- 滤波、采样电路中作为阻抗元件使用（注意功率与噪声要求）。
五、可靠性与封装说明
0402 尺寸便于标准贴片机与回流焊工艺装配。为保证长期可靠性，建议按照厂商 Datasheet 与 IPC/JEDEC 回流规范进行焊接，避免多次超温回流与过度机械应力。储存与运输应防潮防尘，贴片带卷包装便于自动化贴装。
六、选型与使用建议
- 功率与电压：在实际电路中应考虑功率余量与老化/温升影响，建议在长期工作条件下适当降额（例如不持续接近额定功率与最大工作电压），以延长寿命并提高稳定性。
- 布局：采用对称焊盘与恰当焊膏量可降低 tombstone（竖立）风险，焊盘尺寸按厂商推荐值设计。
- 可靠性验证：关键应用建议参考风华官方 Datasheet 中的耐焊测试、温度循环与湿热测试数据，必要时做样机验证。
- ESD 与清洗：对高阻值器件在高静电或强化学清洗环境下应采取防护措施，避免在清洗工序中产生电化学腐蚀。
总结：RC-02K4992FT 以其小尺寸、1% 精度与工业级温度特性，适合高密度、低功耗与对阻值稳定性有一定要求的应用。选型与使用时应关注功率降额与焊接工艺细节，按厂方资料实施可靠性评估。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
