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FH RC-01W3002FT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RC-01W3002FT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RC-01W3002FT
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 30kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264862674
- Operating Temperature
- 55℃~+125℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-01W3002FT 产品概述
一、产品简介
RC-01W3002FT 为风华（FH）出品的贴片厚膜电阻，封装尺寸为 0201（公制约 0.6×0.3 mm 级别），标称阻值 30kΩ，额定功率 1/20W（50 mW），阻值精度 ±1%。该器件适用于超小型、高密度电路板的通用分压、滤波、上拉/下拉等场合，兼顾体积与成本的应用需求。
二、主要参数
- 电阻类型：厚膜贴片电阻
- 阻值：30 kΩ
- 精度：±1%
- 额定功率：50 mW（1/20W）
- 最大工作电压：25 V
- 温度系数（TCR）：±200 ppm/℃
- 工作温度范围：-55 ℃ ～ +125 ℃
- 封装：0201（风华品牌）
三、产品特性与适用边界
- 小尺寸、高密度：0201 封装适合移动设备、蓝牙模块、摄像头模组等对空间要求严格的应用。
- 精度与成本平衡：±1% 精度在绝大多数模拟与数字电路中可满足常规分压与阻抗匹配需求。
- 温漂与精密限制：TCR ±200 ppm/℃ 表明温度敏感度相对较高，若系统要求极低温漂或高精度（例如精密测量或基准电路），建议选用薄膜或金属膜低 TCR 器件。
- 功率与电压限制：50 mW 的功率等级和 25 V 的工作电压决定了该型号不适合大功率或高压应用，应避免在高功耗节点长期使用。
四、典型应用场景
- 移动终端与可穿戴设备的上拉/下拉、偏置网络。
- 高频/数字电路中的阻值设定、分压与阻抗匹配（需注意 TCR 对精度的影响）。
- 传感器前端、ADC 输入的分压与滤波（若对温漂要求较高请评估是否合适）。
- 高密度模块与射频前端的非功率负载电阻。
五、PCB 设计与装配建议
- 采用器件供应商或行业推荐的 0201 封装焊盘尺寸和丝网开孔，保证焊膏量适中以避免浮贴或虚焊。
- 装配使用精密贴装设备与感温曲线可控的回流工艺，避免过度机械应力和过热。
- 对焊接应力敏感的应用建议在封装周围留足缓冲区，避免板弯曲引起焊点开裂。
六、选型提示与替代方案
- 若电路对温度稳定性或长期漂移有较高要求，可考虑薄膜/金属膜、低 TCR（几十 ppm/℃）的替代件。
- 若实际电流或功耗超过 50 mW，应升级到更大封装（0402、0603 等）或更高功率等级的器件。
- 在需要更严格公差（如 0.1%）或低噪声特性的场合，选择更高规格的精密电阻器。
总结：RC-01W3002FT 以其 0201 超小封装和 ±1% 的精度，在空间受限的通用电子产品中具备良好适用性。选型时需重点考虑功率、工作电压与温漂对系统性能的影响，必要时通过更换封装或材质获得更佳的稳定性与可靠性。
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