Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0402X105K100NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0402X105K100NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402X105K100NT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0257283072
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402X105K100NT — 0402贴片电容 1µF ±10% 10V X5R（FH 风华）
一、产品概述
0402X105K100NT 为风华（FH）系列多层陶瓷贴片电容（MLCC），标称电容值 1.0 µF，公差 ±10%，额定直流电压 10 V，温度特性为 X5R。封装为 0402（常用尺寸，约 1.0 mm × 0.5 mm），适合对空间和封装高度有严格要求的移动设备和高密度电路板应用。
二、主要特性
- 电容值：1.0 µF（标称）
- 公差：±10%（常温下）
- 额定电压：10 V DC
- 温度特性：X5R（工作温度范围 -55°C 至 +85°C，典型温度依赖导致电容在此范围内可变动，按 X5R 标准允许出现一定幅度变化）
- 封装：0402 SMD，适合自动贴装与回流焊工艺
- 品牌：风华（FH）
三、性能与使用注意
- 温度与偏压影响：X5R 材料电容随温度与直流偏压（DC Bias）会发生较明显变化，设计时应考虑在实际工作电压下的有效电容，必要时加大额定电容或并联多只使用。
- 高频特性：小封装自感和等效串联电阻（ESR）较低，适合去耦和旁路，但在高频滤波设计时需评估串联阻抗曲线。
- 可靠性：0402 体积小、机械强度相对较低，贴装和拆焊时应避免机械应力和过度弯曲，以免造成裂纹或失效。
四、PCB 设计与装配建议
- 放置：去耦电容应尽量靠近电源引脚布置，走线短而宽，减少回路面积以降低寄生感抗。
- 并联：为改善温漂和 DC-bias 效应，或降低 ESR/ESL，可考虑并联多个电容（同容量或不同容量组合）。
- 焊接：采用标准回流焊工艺，遵循供应商推荐的回流温度曲线（峰值温度及时间按 JEDEC 指南）。0402 对焊接应力敏感，回流和回流后冷却应尽量均匀，避免热冲击。
- 焊盘与胶点：根据风华提供的 PCB 焊盘设计建议制作焊盘，贴片前使用适量助焊膏并确保贴装精度，必要时采用点胶固定以防震动移位。
五、应用场景
- 电源去耦与稳压器输出旁路
- 手机、耳机、可穿戴设备等便携式电子产品的滤波与旁路
- 数字电路高频去耦、瞬态抑制
- 工业与通信设备中对体积与高度有严格限制的电路模块（在符合工作环境要求下使用）
六、包装与储存
- 常见包装为托盘或卷带（Tape & Reel），适配自动贴装机使用。
- 储存时应避免潮湿，若长时间暴露在高湿环境或超过厂商规定的密封期限，贴片电容可能需要回烘处理以避免回流焊时出现焊接缺陷。
如需更详细的电气参数（温度曲线、DC-bias 曲线、ESR/ESL 数据）、PCB 焊盘尺寸图或回流曲线，请提供需求，我可协助查询或整理风华官方数据手册中的具体资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
