WMSIC Electronic Components

FH RC-02K105JT

ModelRC-02K105JT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K105JT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K105JT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.022g
Electronic Component
1MΩ
Electronic Component
50
Electronic Component
BM0263548001
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FH风华RC-02K105JT厚膜贴片电阻产品概述

一、产品基本属性与定位

FH风华RC-02K105JT是一款0402封装工业级厚膜贴片电阻,隶属于风华电子常规电阻系列,主打「小体积高密度、宽温稳定、成本可控」三大核心优势,广泛适配消费电子、工业控制、物联网等对空间紧凑性与信号稳定性有要求的电路设计,是替代进口同类产品的高性价比选择。

二、核心技术参数解析

该电阻的参数设计精准匹配常规电路需求,关键指标如下:

2.1 阻值与精度

标称阻值1MΩ(10⁶Ω),精度**±5%**——满足大多数非高精度场景(如分压、限流、信号滤波)的误差要求,无需额外校准即可覆盖工业级与消费类电路的基础需求。

2.2 功率与功耗

额定功率62.5mW(0.0625W),适配低功耗电路(如传感器前端、微控制器I/O口限流)。实际使用需注意:环境温度>85℃时,建议降额至额定功率的50%(避免热过载导致阻值漂移)。

2.3 温度系数(TCR)

±100ppm/℃——表示温度每变化1℃,阻值变化±100×10⁻⁶倍。以工作温区-55℃~155℃为例,温度跨度210℃,最大阻值变化量为21Ω(±2.1%),可有效保障宽温环境下的信号稳定(如户外工业设备、车载辅助电路)。

2.4 工作温区

覆盖**-55℃~+155℃**,符合工业级环境温度标准,可应对极端低温(如北方户外设备)与高温(如车载电子舱内)场景,避免阻值失效。

三、封装与工艺特点

3.1 封装尺寸

采用0402封装(英制代码,公制尺寸≈1.0mm×0.5mm),是贴片电阻中最小的主流封装之一,适配高密度PCB布局(如智能手机主板、智能穿戴设备),可节省30%以上的电路空间。

3.2 厚膜工艺优势

  • 稳定性:厚膜丝网印刷技术使电阻层附着牢固,长期工作阻值变化率≤±0.5%(1000小时额定条件下);
  • 成本可控:相比薄膜电阻,厚膜工艺量产一致性高、成本低,适合大规模工业化应用;
  • 环保合规:采用无铅工艺,符合RoHS 2.0、REACH标准,可出口全球市场。

四、典型应用场景与优势

4.1 核心应用场景

  1. 消费电子:智能手机/平板的音频滤波、电源监控分压电路;
  2. 工业控制:PLC输入输出接口限流、温度传感器信号调理;
  3. 物联网设备:智能门锁、智能家居传感器的低功耗信号链路;
  4. 汽车电子:车载仪表盘背光调节、小功率传感器(如胎压监测辅助)接口。

4.2 应用优势

  • 小体积适配高密度设计,降低PCB成本;
  • 宽温区覆盖工业/车载环境,减少环境适应性测试成本;
  • 风华品牌质量管控,批量一致性优于行业平均水平(批次阻值离散度≤±0.2%)。

五、可靠性与质量管控

FH作为国内电子元器件龙头,RC-02K105JT通过多项严苛测试:

  • 耐焊接热:符合J-STD-020标准,可承受回流焊峰值温度≤260℃(时间≤10秒);
  • 湿度可靠性:通过IEC 60068-2-67(温度湿度循环)测试,1000小时后无阻值漂移;
  • 机械可靠性:抗振动(10~2000Hz,加速度10g)、抗冲击(峰值加速度50g)符合GB/T 2423标准。

六、选型与使用注意事项

6.1 选型参考

  • 若需更高精度(±1%):可选风华同系列RC-02J105JT;
  • 若需更高功率(1/16W):可选0603封装的RC-03K105JT;
  • 若需汽车级认证:可选风华同参数的AEC-Q200版本(需确认型号后缀)。

6.2 使用注意

  1. 焊接时避免过温(波峰焊温度≤250℃,时间≤5秒);
  2. PCB布局需远离大功率器件(如电源芯片),减少热干扰;
  3. 批量使用前建议抽样测试(1000小时老化后阻值变化),确保批次一致性。

该产品凭借「小体积+宽温稳定+成本优势」,成为中低端电路设计的主流选择,广泛应用于3C、工业、物联网等领域,是风华电子电阻系列中的经典型号。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.