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FH 0402B151K500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0402B151K500NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402B151K500NT
- Electronic Component
- 1
- Electronic Component
- 150pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0257283199
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B151K500NT 产品概述
一、产品简介
0402B151K500NT 是风华（FH）系列的小尺寸多层陶瓷贴片电容（MLCC），标称容量 150 pF，室温公差 ±10%，额定电压 50 V，介质分类 X7R。该产品适用于高密度贴片电路板，对空间受限、要求可靠性的消费电子、通讯和汽车电子等场合具有良好适配性。
二、主要电气参数
- 容值：150 pF（标称）
- 公差：±10%（K）
- 额定电压：50 V DC
- 介质：X7R（温度范围典型为 −55°C 至 +125°C，温度引起的电容变化在 X7R 规范允许范围内）
- 适用频率范围：宽频段工作，具有较高自谐频率，适合去耦与滤波应用
三、封装与机械信息
封装为 0402（典型尺寸约 1.0 × 0.5 mm，厚度视工艺略有不同），适合高密度 SMT 贴装工艺。端接采用常见金属化终端，支持常规回流焊处理。
四、特性与工程注意点
- X7R 为类 II 陶瓷，提供中等温度稳定性与较高容值密度，但在温度、偏压（DC bias）下电容会发生可观变化；设计时需考虑工作电压下的实际电容衰减。
- MLCC 本体具有极低的 ESR 和较低的 ESL，适合高频去耦及旁路，但并联使用可以进一步改善频率响应。
- 对机械应力敏感，PCB 应避免在电容附近产生过大的弯曲和应力集中。
五、典型应用场景
- 电源去耦与旁路（尤其在高频部分）
- 滤波与耦合网络（RF 前端、信号链耦合）
- 振荡与定时电路（与电阻、晶体等配合使用）
- 移动设备、物联网模组、通讯设备等空间受限设计
六、焊接与设计建议
- 推荐采用标准 SMT 回流焊工艺，遵循风华或通用回流曲线；避免多次过热。
- 设计 PCB land pattern 时参考厂方推荐焊盘，保证良好焊点和热阻匹配以降低应力。
- 在高可靠性应用中考虑适当电压降额与裕度，并在关键位置采用并联不同容值组合以覆盖更宽频带。
- 储存与处理应避免潮湿、高温和机械冲击，必要时按厂家建议进行烘干和湿敏等级处理。
七、品质与检验
出厂一般经过电容量、公差、绝缘、电阻及外观等常规 100% 或批量抽检测试。符合 RoHS 要求，常见可靠性试验包括热循环、湿热和焊接热稳定性验证。选型时可向供应商索取详细规格书与可靠性测试报告以满足特殊应用要求。
总结：0402B151K500NT 以其小体积、良好电气特性和适用的 X7R 介质，适合在要求空间紧凑且需中等温度稳定性的电子设计中做去耦、滤波与耦合使用。设计时应关注 DC bias、热机械应力及焊接工艺，以保证长期可靠性。
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