Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0603CG470J500NT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0603CG470J500NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0603CG470J500NT
- Electronic Component
- 1
- Electronic Component
- 47pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0000001531
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0603CG470J500NT 贴片电容（MLCC）
1. 产品简介
0603CG470J500NT 是一款高品质的多层陶瓷电容器（MLCC），由华东地区著名的电子元器件制造商——风华（FH）生产。该电容器采用0603封装，是市场上常见的表面贴装电容器类型，具有小型化、轻量化和高电气性能的优点，广泛适用于现代电子设备中的各种应用。
2. 主要规格
- 电容值: 47pF
- 工作电压: 50V
- 允许偏差: ±5%
- 介电材料: C0G（NP0）
- 封装尺寸: 0603（长：1.6mm，宽：0.8mm）
3. C0G介电材料的优势
C0G（也称为NP0）是高性能陶瓷电容器的一种介电材料。其特点包括：
温度稳定性: C0G材料的电容值随温度变化极小，保证了电容在宽温度范围内的稳定性。该特性特别适用于对温度变化敏感的高精度电路应用。
低损耗: C0G介电材料拥有极低的介电损耗，适合高频及射频应用。这使得0603CG470J500NT非常适合用于高频信号处理领域，如射频放大器、滤波器及其他高频电路。
安全可靠: C0G电容器的电压特性和耐电压性能优秀，使得其在长期使用中表现出良好的可靠性和安全性。
4. 应用领域
0603CG470J500NT 贴片电容广泛应用于多个领域及设备，包括但不限于：
通信设备: 由于其优良的频率特性，适合用于通信信号处理电路，如基站、路由器和无线设备。
消费电子: 在手机、平板电脑及其他便携式设备中，降低电容尺寸和提高电容值的需求使得0603型电容器成为理想选择。
工业设备: 用于工业控制系统和自动化设备，确保信号传递的准确性和稳定性。
汽车电子: 在现代汽车的电子控制单元（ECU）中，该电容器可用于滤波、耦合和解耦等功能。
5. 安装与使用
0603型表面贴装元件在PCB板上的安装非常方便。其典型焊接方式为回流焊或波峰焊，具备良好的贴装兼容性。安装时，须确保电容器的极性正确（对于非极性电容，例如C0G型电容器，则可双向安装）。
在PCB设计中，应留有足够的焊盘面积和适当的间距，以避免电容器因环境变化或物理应力而损坏。此外，考虑到高频性能，尽量缩短引出线长度，以减少寄生电感和电容的影响。
6. 结论
0603CG470J500NT贴片电容器凭借其小巧的0603封装、优良的电气性能和广泛的应用范围，成为现代电子电路设计中的重要元件。无论是在高速数据传输、精密测量还是信号处理等各种场合，这款电容器都能提供可靠的支持。其高稳定性和低损耗特点，使得06103型电容者在未来的电子产品开发中仍将继续发挥重要作用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
