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FH 0201B102K250NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0201B102K250NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201B102K250NT
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 10
- Electronic Component
- BM0257367105
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201B102K250NT 产品概述
一、产品简介
0201B102K250NT 是风华（FH）供应的一款片式多层陶瓷电容（MLCC），标称容量 1nF（102）、公差 ±10%（K）、额定电压 25V，介质材料为 X7R。器件采用超小型 0201 封装，适合高密度 PCB 布局与微型化便携电子产品。该产品面向去耦、滤波、耦合等一般用途电路，兼顾体积、性能与成本。
二、主要参数
- 容值：1nF（102）
- 精度：±10%（K）
- 额定电压：25V DC
- 温度系数：X7R（-55°C 至 +125°C，电容值变化在 ±15% 范围内）
- 封装：0201（尺寸约 0.6 mm × 0.3 mm，具体尺寸以厂方数据为准）
- 类型：多层陶瓷片式电容（MLCC）
三、特性与优势
- 超小封装：0201 封装适合高密度贴片与微型化设计，节省 PCB 面积。
- 稳定温度特性：X7R 在宽温度范围内保持较小的电容变化，适合大多数工业与消费类应用。
- 高频性能良好：自谐频率高，ESR/ESL 低，适合电源去耦与电磁兼容（EMC）应用。
- 成本与可得性：作为常用规格，供应稳定，适合批量生产使用。
四、典型应用
- 电源去耦与旁路（移动设备、主板、模块电源）
- 高频滤波与阻尼网络（射频前端以外的通用滤波）
- 耦合/旁通电容（音频、信号链）
- 可穿戴设备、物联网终端、蓝牙/无线模块、摄像模组等空间受限场景
五、使用与设计注意事项
- 直流偏置效应：X7R 在加电压时会出现电容下降，尤其在接近额定电压时更明显，设计时应预留裕量或选更大初始容量。
- 温度与老化：X7R 存在随温度与时间缓慢漂移现象，长期稳定性不及 C0G/NP0，关键电路如参考或精密定时应优先选用温度补偿型陶瓷。
- 回流焊工艺：建议按 IPC/JEDEC 推荐的回流温度曲线进行焊接，避免超温或重复高温循环导致电容劣化或破裂。
- 处理与贴装：0201 为极小尺寸，贴装需保证贴片机精度与良好锡膏印刷；防静电与防潮处理也很重要。
六、储存与可靠性
- 储存建议：密封干燥、避免高湿高温环境（常温常湿或依厂方包装说明）。
- 可靠性测试：通过温度循环、湿热、耐焊性与机械冲击等可靠性验证，具体性能以风华提供的产品认证与数据表为准。
七、替代与选型建议
- 若电容稳定性或精度要求更高，可选 C0G/NP0 系列；若需更高额定电压或更大容量，可考虑更大封装（0402、0603）。
- 市场上常见的互换规格可标注为“0201 1nF X7R 25V ±10%”，采购时对照封装尺寸、介质代码与厂方型号确认兼容性。
如需完整数据手册、封装图或回流焊曲线，可提供您的邮箱或直接查询风华官网/技术支持获取官方资料。
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