Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B103K250NT 是一款由风华(FH)公司生产的贴片多层陶瓷电容(MLCC),广泛应用于各种电子设备中。该电容具有小尺寸、高可靠性和优异的电气性能,适用于高频电路、滤波电路、耦合电路等多种应用场景。
0402B103K250NT 的标称容值为10nF,精度为±10%。这意味着在实际应用中,电容的容值可能在9nF到11nF之间波动。这种精度适用于大多数通用电路设计,尤其是在对容值要求不特别严格的场合。
该电容采用X7R材质,具有较好的温度稳定性。X7R材质的温度系数为±15%,在-55°C到+125°C的温度范围内,电容的容值变化不超过±15%。这使得0402B103K250NT 在宽温度范围内仍能保持稳定的性能,适用于各种环境条件下的电子设备。
0402B103K250NT 的额定电压为25V,这意味着在正常工作条件下,电容可以承受的最大电压为25V。超过这个电压可能会导致电容损坏或性能下降。因此,在设计电路时,应确保工作电压不超过25V。
该电容采用0402封装,尺寸为1.0mm x 0.5mm。这种小尺寸封装使得0402B103K250NT 非常适合高密度电路板设计,尤其是在空间受限的便携式电子设备中。
0402B103K250NT 贴片电容广泛应用于以下领域:
0402B103K250NT 由风华(FH)公司生产,风华是国内知名的电子元器件制造商,以其高质量和可靠性著称。风华的产品经过严格的质量控制和测试,确保在各种应用场景下都能提供稳定的性能。
0402B103K250NT 是一款高性能的贴片多层陶瓷电容,具有小尺寸、高可靠性和优异的电气性能。由风华(FH)公司生产,广泛应用于消费电子、通信设备、工业控制、汽车电子、医疗设备等多个领域。其X7R材质和0402封装使得该电容在宽温度范围内仍能保持稳定的性能,非常适合高密度电路板设计。在使用时,应注意电压限制和温度范围,以确保电容的长期稳定工作。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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