WMSIC Electronic Components

FH RS-03K1303FT

ModelRS-03K1303FT
Package0603
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RS-03K1303FT
Type
FH
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RS-03K1303FT
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
130kΩ
Electronic Component
1
Electronic Component
BM0257366788
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS-03K1303FT 产品概述

一、产品简介

RS-03K1303FT 是风华(FH)出品的一款贴片厚膜电阻,封装尺寸为 0603(英制 0201),阻值 130 kΩ,精度 ±1%,额定功率 100 mW,额定工作电压 50 V,温度系数(TCR)为 ±100 ppm/℃,工作温度范围 -55 ℃ 至 +155 ℃。此款电阻针对体积受限、对精度和温漂有一定要求的高阻应用设计,适合批量贴片加工与自动化生产。

二、主要参数一览

  • 电阻类型:厚膜电阻
  • 阻值:130 kΩ
  • 精度:±1%
  • 额定功率:100 mW(常温条件)
  • 额定工作电压:50 V
  • 温度系数:±100 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:0603(贴片)
  • 品牌:FH(风华)

三、产品特点与优势

  • 高精度:±1% 精度可满足多数模拟电路中对阻值稳定性的要求,适用于参考分压、电平拉取等场合。
  • 小型化封装:0603 尺寸适合高密度 PCB 布局,利于产品小型化与重量控制。
  • 宽温度适应性:-55 ℃ 至 +155 ℃ 的工作温度范围,适用于工业级及民用复杂环境。
  • 稳定性与一致性:厚膜工艺在批量生产中具有良好的一致性和成本效益,适合大批量应用。
  • 适中温漂:±100 ppm/℃ 的 TCR 在多数低频与直流电路中可接受,配合电路补偿可获得更稳定的性能。

四、典型应用场景

  • 拉高/拉低电阻(pull-up / pull-down)与偏置网络:用于微控制器输入、模拟信号偏置等。
  • 分压与参考电路:与其他阻值配合实现高阻分压、滤波或检测电路。
  • 传感器接口与功率监测:在高阻抗测量路径中作为限流或偏置元件。
  • 便携与消费电子、通信模组、物联网设备、工业控制板等对体积和可靠性有要求的场合。

五、选型与使用建议

  • 功率与热管理:0603 的额定功率为 100 mW,实际使用时应考虑功率降额与 PCB 散热条件,避免长期在额定功率附近工作以提高寿命。
  • 电压与绝缘:工作电压 50 V,应用时应确保两端电压与周围电场环境不超额定值,特别是在高阻值和高湿度环境下注意爬电距离。
  • 温漂匹配:若电路对温度稳定性要求高,建议在电路级采取温度补偿或选用更低 TCR 的元件组合。
  • 焊接工艺:支持常规无铅回流贴装工艺,建议严格控制回流曲线并参考供应商推荐的焊接参数以避免热应力影响电阻性能。
  • 储存与防护:建议保持原包装防潮密封,避免在高湿、高温环境长期暴露,取用时注意防静电、防污染。

六、可靠性与包装

RS-03K1303FT 采用厚膜制造工艺,适合自动化贴装与回流焊流程。出厂通常提供卷带包装(Tape & Reel),便于 SMT 生产线领用与存储。产品在设计与生产中追求一致性,但在极端环境或特殊可靠性要求(如航空、医疗等)应通过专门的可靠性验证。

七、总结

RS-03K1303FT(FH)是一款面向高密度贴片应用的高阻值厚膜电阻,兼顾精度与体积,适用于众多消费、通信与工业电子领域。在选型时注意功率、工作电压与温漂匹配,合理布局与工艺控制可发挥其最佳性能。如需更详细的电气测试数据、回流曲线或可靠性报告,建议联系供应商获取完整的数据手册与认证资料。

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