WMSIC Electronic Components

FH 0402B153K500NT

Model0402B153K500NT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0402B153K500NT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0402B153K500NT
Electronic Component
1
Electronic Component
15nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0263548174
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

风华0402B153K500NT 片式多层陶瓷电容(MLCC)产品概述

一、产品核心参数梳理

该产品为风华FH品牌0402封装片式多层陶瓷电容(MLCC),核心参数可从型号与官方规格对应明确:

  • 容值与精度:标称容值15nF(型号中“153”=15×10³ pF),精度±10%(“K”标识);
  • 额定电压:直流额定电压50V(“500”标识);
  • 温度特性:X7R温度系数,适用范围-55℃~+125℃,容值随温度变化率≤±15%;
  • 封装尺寸:英制0402(公制1005),典型尺寸1.0mm×0.5mm×0.5mm;
  • 品牌与标识:风华FH,型号中“B”为封装系列,“NT”为产品等级。

参数覆盖MLCC选型核心维度,直接决定适用场景与性能边界。

二、关键性能特性解析

基于X7R介质与风华生产工艺,产品具备以下核心特性:

  1. 宽温稳定:X7R介质适配-55℃~+125℃宽温环境,容值漂移≤±15%,比Y5V更稳定,适合温度敏感电路;
  2. 小型化适配:0402封装体积仅为传统插件电容1/10,可大幅压缩电路板面积,适配便携设备与高密度电路;
  3. 高可靠性:多层叠层工艺使电极与介质结合紧密,通过125℃/1000h高温寿命测试(容值变化≤±10%)、10~2000Hz/1.5g振动测试,满足长期稳定运行;
  4. 低损耗:1kHz频率下损耗角正切值(tanδ)≤2.5%,减少电路能量损耗,提升电源效率与信号完整性。

三、典型应用场景

结合参数特性,产品广泛覆盖以下领域:

  1. 消费电子:智能手机、平板、智能手表的电源滤波(DC-DC去耦)、信号耦合(音频/射频),适配小型化需求;
  2. 汽车电子:车载仪表盘背光、传感器接口的滤波去耦,X7R宽温特性满足-40℃~+85℃车载环境;
  3. 工业控制:PLC模块、传感器节点的信号处理,15nF容值适合中等频率噪声抑制,50V电压满足低压控制电路;
  4. 智能家居:智能音箱、路由器的电源滤波与EMI抑制,0402封装适配小型家电设计;
  5. 医疗设备:血糖仪、血压计的信号调理电路,高可靠性满足医疗设备稳定性要求。

四、选型与使用注意事项

为确保性能与可靠性,需注意以下要点:

  1. 电压降额:实际工作电压建议≤40V(额定电压80%),避免过压击穿,延长寿命;
  2. 封装匹配:焊盘尺寸建议长0.81.0mm、宽0.40.6mm,避免焊接不良;
  3. 焊接工艺:回流焊峰值温度245±5℃,时间≤10秒,避免热应力开裂;
  4. 存储条件:未开封产品存于25±5℃、湿度≤60%环境,开封后1个月内使用,防止受潮;
  5. 精度适配:若需更高精度(如振荡器),需换NPO介质电容,该产品仅适合一般精度需求。

五、品牌与品质保障

风华FH作为国内MLCC龙头,产品通过ISO9001、IATF16949认证,具备完整质量管控体系:

  • 一致性管控:批量容值偏差≤±10%,满足批量生产一致性;
  • 供货稳定:自动化生产线月产能充足,适配中小批量至大规模需求;
  • 定制支持:针对特殊场景可定制更高电压、更小封装等参数。

总结:风华0402B153K500NT是一款性能均衡的X7R介质MLCC,适配多领域小型化、宽温电路设计,是消费电子、工业控制等场景的可靠选型。

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