WMSIC Electronic Components

FH 0201X223K100NT

Model0201X223K100NT
PackageSMD
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0201X223K100NT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0201X223K100NT
Electronic Component
1
Electronic Component
22nF
Package
SMD
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0265105226
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:0201X223K100NT - FH(风华)贴片电容

一、基本信息

商品分类:贴片电容(MLCC)
品牌:FH(风华)
工艺类型:SMD(表面贴装元件)
型号:0201X223K100NT
容值:22nF
温度系数:X5R
精度:±10%
额定电压:10V
封装类型:0201

二、产品特性

1. 贴片电容的定义与应用
贴片电容,即多层陶瓷电容器(MLCC),是一种常见于现代电子设备中的重要无源元件。它们因其小型化和优良的电性能被广泛应用于各种电子产品,如手机、计算机、LED照明、家用电器以及工业控制装置等。

2. 优秀的电性能
该型号的贴片电容具有22nF的容值,适应多种频率的工作环境。它的温度系数为X5R,这意味着在-55°C到+85°C的温度范围内,其电容值变化不超过±15%。这种稳定性使其非常适合用于对温度变化敏感的电路,保证了电路的可靠性。

3. 保持较高的额定电压
0201X223K100NT的额定电压为10V,能够有效地应对一般应用中的电压波动。这一特性使得其在直流电压下的表现稳定,适合于多种电源管理应用。

4. 精确的电容值
其±10%的精度保证了在各种应用中均能提供稳定的电容性能,为电路设计师在设计和优化电路时提供了充分的灵活性。

三、封装与安装特性

这款电容采用0201封装形式(即0.02英寸 x 0.01英寸),极其紧凑,能够满足当前电子产品对小型化和高密度排列的要求。在拥挤的电路板上,0201封装的元件能够帮助设计师优化空间利用,提高整体设计美感。

此外,贴片电容采用表面贴装工艺(SMD)进行安装,相比传统的引线电容,表面贴装技术能够减少线路板上元件的高度,有效提升整体的机械强度和稳定性。

四、广泛的应用领域

0201X223K100NT适合于多个领域的应用,主要包括:

  1. 消费电子:手机、平板电脑、电视、音响等设备中,用于去耦、滤波和信号耦合等功能。
  2. 工业设备:在工业自动化及控制系统中,用于电源过滤、稳压和信号处理。
  3. 车载电子:在汽车电子控制单元中,确保电源质量和信号传输的可靠性。
  4. 医疗设备:在各类医疗设备中,保证电子信号的稳定性与安全性。

五、总结

FH(风华)的0201X223K100NT是一款具备22nF容值、±10%精度、10V额定电压的优质贴片电容,采用X5R温度系数,表现出良好的温度稳定性和可靠性。其小巧的0201封装形式以及SMD技术,使其非常适合于高密度电路设计,广泛应用于消费电子、工业设备、车载电子及医疗设备等多个领域。选择0201X223K100NT,能够为您的电路设计提供强有力的支持,确保产品的高性能和高可靠性。

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