WMSIC Electronic Components

FH RC-02K2701FT

ModelRC-02K2701FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K2701FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K2701FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.022g
Electronic Component
2.7kΩ
Electronic Component
50
Electronic Component
BM0264548561
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-02K2701FT 贴片厚膜电阻产品概述

一、产品基本定位

RC-02K2701FT是风华高科(FH品牌)推出的0402封装贴片厚膜电阻,属于小功率、高精度通用型器件,核心用于电子电路的分压、限流、滤波、信号调理等基础功能,适配小型化、高密度PCB设计的电子设备,兼顾成本与性能平衡。

二、核心技术参数

该产品参数明确,可满足多数中低功耗电路的设计需求:

参数项 具体规格 封装类型 0402(英制,公制1005) 电阻类型 厚膜电阻(氧化铝基片) 标称阻值 2.7kΩ(2700Ω) 精度等级 ±1%(工业级常用精度) 额定功率 1/16W(62.5mW) 最大工作电压 50V(直流/交流通用) 温度系数(TCR) ±100ppm/℃ 工作温度范围 -55℃ ~ +155℃ 品牌厂商 风华高科(FH)

三、设计特点与性能优势

1. 小体积高密度适配

0402封装(尺寸约1.0mm×0.5mm)是贴片电阻中体积较小的规格之一,可减少PCB占用面积60%以上,特别适合智能手机、智能手表等便携设备的高密度布局。

2. 高精度稳定可靠

±1%的精度等级可满足传感器信号调理、电源分压电路等对阻值精度要求较高的场景,避免因阻值偏差导致的信号失真(如压力传感器输出误差控制在0.5%以内)。

3. 宽温环境适应性

-55℃至+155℃的工作温度范围覆盖工业级环境(如户外温湿度传感器、小型PLC),且±100ppm/℃的温度系数保证温度变化时阻值漂移极小(155℃时相对于25℃的阻值变化仅约1.3%)。

4. 厚膜工艺成本优势

采用厚膜印刷+烧结工艺,相比薄膜电阻成本降低30%左右,同时具备较好的抗浪涌能力(可承受10倍额定功率的瞬时浪涌),适合批量生产应用。

四、典型应用场景

RC-02K2701FT因参数适配性强,广泛应用于以下领域:

  1. 消费电子便携设备:智能手机主板的电池分压电路、智能手表心率传感器接口的限流电阻;
  2. 物联网(IoT)终端:温湿度传感器节点的信号滤波、低功耗蓝牙模块的偏置电阻;
  3. 工业控制电路:小型PLC输入输出接口的上拉电阻、工业电机转速传感器的调理电路;
  4. 汽车电子辅助电路:车内氛围灯控制的限流、胎压监测模块的辅助分压(非安全类场景);
  5. 通信设备:小型路由器、WiFi 6模块的射频前端偏置电路。

五、使用注意事项

为保证产品性能与寿命,需注意以下要点:

  1. 功率降额:实际使用功率建议不超过额定功率的50%(≤31.25mW),避免长期过载导致阻值漂移(降额后寿命可延长2-3倍);
  2. 电压限制:工作电压不得超过50V,防止击穿损坏(若需更高电压,需串联电阻或选择高压型号);
  3. 焊接工艺:采用回流焊(禁止手工烙铁焊接),焊接温度需符合0402封装规范(峰值温度240-260℃,持续时间≤10秒);
  4. 存储条件:未焊接产品需存储在温度-40℃~+30℃、湿度≤60%的环境中,避免受潮影响焊接附着力。

六、选型替代参考

若需替代,可选择同参数的其他品牌产品:

  • 国巨:RC0402JR-072K7L;
  • 三星:CL05K2701GCNR;
  • 风华同系列:RC-02K系列其他阻值(如2.2kΩ、3.3kΩ)。

综上,RC-02K2701FT凭借小体积、高精度、宽温适应等特点,成为电子电路设计中通用型贴片电阻的优选方案,适配各类中低端到工业级的电子设备需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.