Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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RC-02K2701FT是风华高科(FH品牌)推出的0402封装贴片厚膜电阻,属于小功率、高精度通用型器件,核心用于电子电路的分压、限流、滤波、信号调理等基础功能,适配小型化、高密度PCB设计的电子设备,兼顾成本与性能平衡。
该产品参数明确,可满足多数中低功耗电路的设计需求:
参数项 具体规格 封装类型 0402(英制,公制1005) 电阻类型 厚膜电阻(氧化铝基片) 标称阻值 2.7kΩ(2700Ω) 精度等级 ±1%(工业级常用精度) 额定功率 1/16W(62.5mW) 最大工作电压 50V(直流/交流通用) 温度系数(TCR) ±100ppm/℃ 工作温度范围 -55℃ ~ +155℃ 品牌厂商 风华高科(FH)0402封装(尺寸约1.0mm×0.5mm)是贴片电阻中体积较小的规格之一,可减少PCB占用面积60%以上,特别适合智能手机、智能手表等便携设备的高密度布局。
±1%的精度等级可满足传感器信号调理、电源分压电路等对阻值精度要求较高的场景,避免因阻值偏差导致的信号失真(如压力传感器输出误差控制在0.5%以内)。
-55℃至+155℃的工作温度范围覆盖工业级环境(如户外温湿度传感器、小型PLC),且±100ppm/℃的温度系数保证温度变化时阻值漂移极小(155℃时相对于25℃的阻值变化仅约1.3%)。
采用厚膜印刷+烧结工艺,相比薄膜电阻成本降低30%左右,同时具备较好的抗浪涌能力(可承受10倍额定功率的瞬时浪涌),适合批量生产应用。
RC-02K2701FT因参数适配性强,广泛应用于以下领域:
为保证产品性能与寿命,需注意以下要点:
若需替代,可选择同参数的其他品牌产品:
综上,RC-02K2701FT凭借小体积、高精度、宽温适应等特点,成为电子电路设计中通用型贴片电阻的优选方案,适配各类中低端到工业级的电子设备需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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