Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH RS-06K10R0FT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RS-06K10R0FT
- Type
- FH
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RS-06K10R0FT
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.048g
- Electronic Component
- 10Ω
- Electronic Component
- 1
- Electronic Component
- BM0000001364
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：RS-06K10R0FT 贴片电阻
一、基本信息
RS-06K10R0FT是一款由风华（FH）品牌生产的贴片电阻，具有250mW的功率承载能力，阻值为10Ω，精度为±1%。该电阻采用1206封装规格，广泛应用于各种电子设备中。由于其优良的性能和可靠的质量，RS-06K10R0FT成为了研发和生产电路中不可或缺的一部分。
二、技术规格
阻值：10Ω
- 阻值是电阻的基本特性，它决定了电流的流动和电路的性能。10Ω的阻值在很多电路应用中非常实用，适合用于需要稳定负载和保护电路的应用场景。
功率额定值：250mW
- 这款电阻的功率额定值为250mW，说明其能够承受的最大功率。适合于低功率应用，确保在正常工作条件下不会发生过热导致损坏。
精度：±1%
- 电阻精度为±1%，意味着其实际阻值与标称值之间的偏差不超过1%。这一较高的精度使其适合用于要求较高的电路设计中，确保信号的准确性和稳定性。
封装类型：1206
- 1206封装是一种流行的表面贴装封装，尺寸为3.2mm x 1.6mm。由于其较小的尺寸，它适合在空间有限的电路板上使用，同时提供了良好的散热性能。
三、应用场景
RS-06K10R0FT贴片电阻适用于广泛的应用场合，包括但不限于：
- 消费电子产品：如智能手机、平板电脑和其他便携式设备，在信号处理、功率管理和电源分配等电路中常用到此类电阻。
- 汽车电子：在汽车音响、导航系统和车载控制模块中，稳定的电阻性能可以有效提高系统的可靠性。
- 工业控制设备：在劣恶的环境条件下，RS-06K10R0FT可用于各种监控和控制电路中，为设备提供必需的电流限制和保护功能。
- 医疗设备：在要求精度高、安全性可靠的医疗电子设备中，贴片电阻起着至关重要的作用，确保设备的正常运行和数据的准确传输。
四、优势特点
稳健的性能：RS-06K10R0FT具备良好的温度稳定性，能在不同的环境条件下保持其性能，适合于高温和低温的工业应用。
高可靠性：作为厚膜电阻，RS-06K10R0FT具有较好的抗湿性和抗腐蚀性，确保产品长期以来的稳定性和耐用性。
高性能与小型化：1206封装使得该贴片电阻适合于紧凑型设计，可以为现代电子设备的迷你化需求提供解决方案。
便捷的表面贴装设计：该电阻适合于自动化焊接的表面贴装技术（SMT），提高了生产效率，降低了生产成本。
五、总结
总之，RS-06K10R0FT贴片电阻是一款具有优良性能和稳定特性的电子元器件，适合广泛的应用领域。其10Ω的适中阻值、250mW的功率额定值及±1%的高精度，为各种电子设备提供了可靠的性能支持。凭借其小巧的1206封装和优越的技术参数，该产品无疑是电子工程师在设计电路时值得信赖的选择。风华（FH）品牌的可靠性与科技创新将在未来继续引领电子元器件市场的变革与发展。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
