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FH 0201CG3R0B500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- FH 0201CG3R0B500NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201CG3R0B500NT
- Electronic Component
- 1
- Electronic Component
- 3pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0265117061
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0201CG3R0B500NT
一、基本信息
产品型号：0201CG3R0B500NT
商品分类：贴片电容（MLCC）
容值：3pF
材质（温度系数）：C0G
额定电压：50V
品牌：FH（风华）
封装：0201
二、产品描述
0201CG3R0B500NT 是一款高性能的贴片电容，采用多层陶瓷电容器（MLCC）技术，容值为3皮法拉（pF），额定电压为50伏特（V）。其使用的材料类型为 C0G（也称为 NP0），这是一种具有优良温度特性的陶瓷电容器，适用于高稳定性要求的应用场合。封装尺寸为0201，这使得该电容非常适合用于空间有限的高密度电路设计中。
三、性能特点
高稳定性：C0G/NP0 介质材料的电容器具有极低的温度系数，能够在宽温度范围内保持电容值的稳定性，适合用于精密频率控制和滤波器设计。
高绝缘电阻：该电容器在其额定电压下能够提供极高的绝缘电阻，有效防止漏电，从而增强电路的可靠性和稳定性。
低失效率：0201CG3R0B500NT 的设计使得其在长期工作下也能保持优秀的性能，适合高可靠性应用如航空航天、医用设备及军事装备等。
小型化设计：0201 封装尺寸（0.02" x 0.01" 或 0.6mm x 0.3mm）的特性，满足当今电子产品对小型化和轻量化的趋向，确保在紧凑的电路板设计中可以实现高密度布局。
四、应用领域
0201CG3R0B500NT 贴片电容因其出色的性能和稳定性，广泛应用于以下领域：
高频通信设备：用于调谐电路、滤波器和信号耦合电路中，帮助提高信号质量和信号传输的稳定性。
计算机和数据处理设备：在主板及其周边电路中，通过为高频电路提供必要的去耦功能，增强整个系统的稳定性和抗干扰性能。
消费电子产品：在手机、平板、电视等植物中，用于音频和视频信号的处理，确保良好的用户体验。
汽车电子：其小巧的尺寸和高可靠性使其成为汽车娱乐和导航系统、动力控制模块及安全系统中的理想元件。
工业控制：在各种工业自动化设备和嵌入式系统中，用于精确控制和数据处理。
五、结论
0201CG3R0B500NT 是一款集高稳定性、低损耗和小型化于一体的贴片电容，凭借其出色的技术参数和应用范围，已在现代电子产品中变得日益重要。无论是在高速通信、计算机设备，还是在消费电子和汽车电子领域，都能找到其身影。选择 FH（风华）的这款电容器，可以为您的设计提供必要的技术支持和保障，确保电子产品在性能上的卓越表现。
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