WMSIC Electronic Components

FH VHF100505HQ39NJT

ModelVHF100505HQ39NJT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH VHF100505HQ39NJT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
VHF100505HQ39NJT
Electronic Component
1
Package
0402
Type
Inductor; Inductor
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.022g
Inductor
39nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0230633549
Current
800mA
Frequency
1.2GHz
Resistor(DCR)
120mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VHF100505HQ39NJT 产品概述

一、概述

VHF100505HQ39NJT 为风华(FH)系列0402 封装的叠层高频贴片电感,标称电感值 39 nH,公差 ±5%。该器件针对 VHF 及更高频段的射频与高频电路设计,体积小、寄生参数受控,适合贴片回流工艺批量生产与自动化装配。

(注:提供资料中“描述”一行显示“1Ω 39nH ±5% 200mA”,与前述基础参数存在不一致。下文参数以前面列出的额定电流 800 mA 与 DCR 120 mΩ 为准;如需以另一组数据为准,请确认具体型号版本。)

二、主要电气参数

  • 电感值:39 nH ±5%
  • 额定电流(Isat/Irms,资料标注):800 mA
  • 直流电阻(DCR):0.12 Ω(120 mΩ)
  • 品质因数(Q):8 @ 100 MHz
  • 自谐振频率(SRF):约 1.2 GHz
  • 类型:叠层电感(Multilayer Chip Inductor)
  • 封装尺寸:0402(1005 公制)

三、性能特点

  • 高频特性:Q 值在 100 MHz 时约为 8,适用于 VHF 频段匹配、滤波与阻抗网络。SRF 1.2 GHz 意味着在 GHz 级别前仍维持电感性行为,可用于较宽频带的射频电路。
  • 尺寸与封装:0402 小尺寸利于高密度布局,适合移动设备、无线模块与微型化射频前端。
  • 电流能力与损耗:120 mΩ 的 DCR 表明器件存在一定的直流损耗,800 mA 的额定电流可满足中等电流的电源或射频偏置路径,但在高电流应用需关注温升与电感值随直流偏置衰减。

四、典型应用场景

  • VHF/UHF 射频匹配网络、带通/带阻滤波器元件
  • 天线匹配与平衡/不平衡变换电路
  • EMI 抑制与共模/差模干扰滤波(与其它无源元件配合)
  • 射频模块、无线通信设备、卫星/广播接收前端的阻感元件
  • 小型开关电源与偏置网络(需评估直流电流与温升)

五、选型与使用建议

  • 频率选择:在接近 SRF 的频段使用时要测试实际电感相位和幅值;若工作频率接近或超过 1/3 SRF,应进行电路级仿真验证。
  • DC 偏置与温升:叠层电感在直流偏置下会产生饱和或感值下降,建议在目标工作电流下量测实际电感与损耗。DCR 导致的功耗需评估散热与可靠性。
  • 焊接与工艺:采用标准回流焊曲线,避免过高峰温和长时间加热;焊盘尺寸与焊膏量按厂方推荐值设计,以保证机械可靠性与电气性能一致性。
  • EMC 布局:尽量将电感靠近源或负载端布置,减少环路面积;与旁路与耦合元件配合时注意阻抗匹配与寄生耦合。

六、可靠性与存储

  • 存储:干燥、常温环境,避免受潮与强振动;若长期存放建议采用防潮包装并按厂家建议回流前进行烘干。
  • 可靠性测试:建议在设计验证阶段进行温度循环、振动、湿热与寿命测试,以确认在目标应用环境下的稳定性与失效模式。

如需器件完整数据手册(包含电流–感值曲线、频率响应曲线和推荐焊盘尺寸图),建议向风华官方或授权分销商索取以便做进一步电路设计与可靠性评估。

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