Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-01W75R0FT是国内老牌电子元器件厂商风华(FH)推出的工业级微型厚膜贴片电阻,针对高密度集成电路设计,兼具高可靠性、宽温适应性与成本优势,广泛适配消费电子、工业控制、通信等领域的小信号处理场景。
RC-01W75R0FT定位于0201封装小型精密电阻,聚焦微型化电路的阻值匹配、限流/分压需求,平衡了性能与量产成本。
风华(FH)作为国内电阻行业龙头,拥有30余年厚膜电阻研发生产经验,产品符合RoHS 2.0、REACH环保标准,通过ISO 9001/TS 16949认证(汽车级延伸),其厚膜工艺(丝网印刷+高温烧结)确保阻值一致性与长期稳定性,是华为、小米等终端厂商的主流选型之一。
RC-01W75R0FT的核心参数覆盖精度、功率、环境适应性等关键维度,具体如下:
参数类别 具体指标 技术价值 电阻类型 厚膜贴片电阻 阻值稳定性优于薄膜电阻(成本低30%),适合批量中低端精密电路 标称阻值 75Ω 常用中值电阻,适配分压、限流、射频匹配等基础电路 精度等级 ±1% 满足一般精密场景(如传感器信号调理、音频电路),无需额外校准 额定功率 50mW(0201封装常规值) 连续工作功率上限,实际建议降额至40mW(80%)避免过载 工作电压 25V(连续) 最大连续电压,峰值电压参考datasheet(≤35V) 温度系数(TCR) ±200ppm/℃ 125℃时阻值变化=(125-25)×200ppm=2%,结合精度1%,总误差≤3%(可控) 工作温度范围 -55℃~+125℃ 覆盖工业级温区,适配北方户外设备、高温车间等极端环境 封装尺寸 0201(英制) 体积仅0.6mm×0.3mm,PCB占用面积0.18mm²,提升集成度(是0402的1/4)0201为无引脚表面贴装设计,适配自动化生产,具备:
风华采用多层烧结工艺:
RC-01W75R0FT因微型化+宽温,广泛用于:
综上,RC-01W75R0FT是高性价比工业级微型电阻,兼顾小型化、可靠性与成本,是高密度集成电路的理想选型。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products