WMSIC Electronic Components

FH 0201CG4R0C500NT

Model0201CG4R0C500NT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
FH 0201CG4R0C500NT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0201CG4R0C500NT
Electronic Component
1
Electronic Component
4pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
10
Electronic Component
BM0265117062
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201CG4R0C500NT 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本属性与型号解析

0201CG4R0C500NT是风华高科(FH) 推出的贴片多层陶瓷电容(MLCC),属于高稳定型高频电容,型号各部分含义明确:

  • 0201:英制封装代码(对应公制0.60mm×0.30mm);
  • CG:温度系数标识(对应EIA标准C0G);
  • 4R0:标称容值4.0pF(R代表小数点);
  • 500:额定直流电压50V;
  • NT:风华内部系列/包装标识(适配编带封装)。

二、核心技术参数详解

该电容以高稳定性、低损耗为核心特点,关键参数如下:

参数项 典型值/标准值 备注 标称容值 4.0pF - 容值公差 ±0.1pF(典型) 符合C0G类电容精密要求 额定电压 50V DC(直流) 交流应用需按降额系数(通常0.7)计算 温度系数 C0G(≤±30ppm/℃) 全温区容值漂移极小 损耗角正切(tanδ) ≤0.15%(1kHz,25℃) 低损耗适配高频电路 绝缘电阻(IR) ≥10¹²Ω(25℃,50V DC,1min) 高绝缘性避免信号泄漏 工作温度范围 -55℃~125℃ 宽温区满足工业/车载等场景

三、封装与物理特性

采用0201小型化封装,适配高密度PCB设计:

  • 尺寸:长0.60±0.05mm、宽0.30±0.05mm、厚0.30±0.03mm;
  • 电极材料:银钯合金(Ag-Pd),兼顾导电性与焊接可靠性;
  • 介质材料:C0G类低温烧结陶瓷,无极性设计(正反可贴);
  • 重量:单颗约0.001g,适合便携设备轻量化需求。

四、温度特性与稳定性优势

C0G是MLCC中温度稳定性最高的类别,该电容核心优势:

  1. 容值漂移极微:在-55℃~125℃范围内,4pF容值变化≤±0.002pF(远优于X7R等温度系数电容);
  2. 频率特性优异:1MHz~1GHz频段内,容值变化≤±0.5%,无谐振点偏移;
  3. 电压特性稳定:50V DC下,容值变化≤±0.05%,无直流偏置效应(区别于Y5V等高介电容)。

五、典型应用场景

因高稳定、低损耗、小型化特点,广泛用于:

  1. 高频振荡电路:石英晶体振荡器(XO)、压控振荡器(VCO)的负载电容,保证振荡频率偏差≤±10ppm;
  2. 射频前端模块:手机、基站的RF滤波、阻抗匹配网络,降低信号插入损耗;
  3. 精密时钟电路:智能穿戴、服务器的时钟同步电路,减少频率漂移;
  4. 工业控制:PLC、传感器的低噪声滤波,保证模拟信号完整性;
  5. 消费电子:平板、笔记本的电源耦合/去耦,适配超薄PCB设计。

六、可靠性与合规性

符合行业标准与环保要求:

  • 焊接可靠性:支持回流焊(峰值245℃,≤30s)、波峰焊(峰值260℃,≤5s),满足IPC-A-610标准;
  • 环境测试:
    • 温度循环(500次):容值变化≤±1%;
    • 湿度负载(85℃/85%RH,1000h):绝缘电阻≥10¹¹Ω;
    • 高温寿命(125℃,50V DC,1000h):容值变化≤±1%;
  • 合规认证:RoHS 2.0、REACH SVHC、无铅认证,适配全球市场。

七、风华品牌与市场价值

作为国内MLCC龙头,该产品具备:

  • 产能稳定:月产能达千万级,满足批量生产需求;
  • 质量管控:通过ISO9001、IATF16949认证,每批全检容值与电压;
  • 性价比优势:相比进口品牌(村田/TDK),成本降低15%-20%,性能相当;
  • 技术支持:提供焊接工艺指导、选型方案,适配不同场景。

该电容是高频精密电路的理想选择,兼顾稳定性与小型化,可替代进口同规格产品,降低BOM成本。

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