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FH 0402CG6R0C500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- FH 0402CG6R0C500NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402CG6R0C500NT
- Electronic Component
- 1
- Electronic Component
- 6pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0257378419
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402CG6R0C500NT 产品概述
一、产品简介
0402CG6R0C500NT 为风华（FH）生产的贴片多层陶瓷电容（MLCC），标称容量 6 pF，额定电压 50 V，介质类型为 C0G（又称 NP0）。封装为 0402（约 1.0 mm × 0.5 mm），适合对温度稳定性和电气线性有较高要求的小型化电路。
二、主要特性
- 温度系数：C0G，温度系数接近 0（典型 0 ±30 ppm/°C），线性好、漂移小；
- 电压系数：C0G 对直流偏置敏感性极低，容量随工作电压变化极小；
- 损耗低：低介质损耗（高 Q 值），适合高频、小信号场合；
- 尺寸小：0402 尺寸适合高密度贴装与移动设备；
- 环保与可靠性：常见满足 RoHS 要求，经过焊接和应力可靠性验证（以厂家数据为准）。
三、主要技术参数（供参考）
- 容值：6 pF；
- 额定电压：50 V DC；
- 温度特性：C0G（0 ppm/°C 级别）；
- 封装：0402（约 1.0 × 0.5 mm）；
- 常见容差：±5% / ±2% 等（具体以料号或出厂标注为准）；
- 回流焊建议：峰值温度 ≤ 260 °C，遵循厂家回流曲线。
四、典型应用
适用于高频匹配、RF 前端、振荡器、滤波器、ADC/DAC 的参考旁路、定时电路和高精度测量电路等场合，尤其在需稳定电容值和低损耗的小型化设计中表现优异。
五、选型与布局建议
- PCB 封装与焊盘：按风华推荐的引脚尺寸与锡膏量布局，避免过大或过小焊盘导致应力集中；
- 应力与弯曲：0402 体积小但脆性仍高，贴片后避免基板弯曲和强力扭曲；
- 温升与焊接：遵循厂家回流曲线，避免超温或重复多次高温回流；
- ESD/过压：虽为 C0G 稳定电容，但应避免超过额定电压和长时间高偏压环境。
六、包装与可靠性
该类元件常见为卷带（Tape & Reel）供货，便于贴片机上料；可靠性测试包括热循环、湿热、机械冲击与高温焊接，具体项目信息应参考风华官方数据手册和检验报告。订购与设计前建议索取并确认完整规格书以满足特殊容差、老化与 MSL 要求。
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