WMSIC Electronic Components

FH 0402CG151J500NT

Model0402CG151J500NT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0402CG151J500NT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0402CG151J500NT
Electronic Component
1
Electronic Component
150pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0263548129
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402CG151J500NT 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本属性与型号解析

0402CG151J500NT是风华高科(FH) 推出的工业级贴片多层陶瓷电容(MLCC),属于C0G(NP0)介质系列,专为高频、高稳定、低损耗场景设计。其型号各部分可精准对应核心参数:

  • 0402:英制封装尺寸,对应公制0.6mm×0.3mm(长×宽),适配小型化高密度PCB;
  • CG:温度系数代码,代表C0G类介质(IEC定义的NP0特性);
  • 151:容值编码,15×10¹=150pF(标称值);
  • J:容值精度,±5%;
  • 500:额定直流电压,50V;
  • NT:风华内部工艺后缀,代表标准无铅外电极及量产规格。

二、关键技术参数详解

该产品核心参数符合工业级标准,关键指标如下:

  1. 容值与精度:标称150pF,精度±5%(J级),宽温下容量漂移极小;
  2. 额定电压:直流50V,交流应用需按有效值降额(典型≤35V);
  3. 温度系数:C0G特性,0±30ppm/℃,-55℃~+125℃内容量变化≤±0.3%;
  4. 封装尺寸:0402(英制),公制0.6mm×0.3mm×0.3mm(长×宽×高),焊盘间距0.2mm;
  5. 介质损耗:tanδ≤0.15%(1kHz,25℃),低损耗适配高频信号;
  6. 绝缘电阻:≥10¹⁰Ω(25℃,50V直流),高绝缘性降低漏电流。

三、材料与工艺特性

采用风华成熟的多层陶瓷叠层工艺,核心材料优势明显:

  • 介质材料:C0G类高温共烧陶瓷(HTCC),无老化效应、低温度漂移,绝缘电阻稳定;
  • 内电极:钯银合金(Pd-Ag),烧结兼容性好,电极连续性优异,降低等效串联电阻(ESR);
  • 外电极:三层结构(镍层+无铅锡层),符合RoHS 2.0,焊接性能稳定,耐硫化;
  • 工艺控制:叠层精度±2μm,批量容量一致性达98%以上,合格率高。

四、典型应用场景

因C0G的高稳定性,该产品广泛用于信号精度要求苛刻的领域:

  1. 射频电路:基站、路由器、无线模块的滤波器、振荡器、阻抗匹配网络;
  2. 测试仪器:示波器、信号发生器、频谱仪的精密信号调理电路;
  3. 消费电子:高端手机、平板的射频前端(PA匹配、天线调谐);
  4. 工业控制:PLC、伺服系统的高频滤波与定时电路;
  5. 医疗设备:监护仪、超声设备的稳定信号传输模块。

五、可靠性与环境适应性

风华针对该产品完成多项可靠性测试,符合行业标准:

  • 耐焊接性:回流焊峰值260℃(J-STD-020),焊接后无开裂、脱落;
  • 机械强度:振动(10~2000Hz,10g)、冲击(1000g,0.5ms)满足IEC 60068-2;
  • 湿度稳定性:85℃/85%RH存储1000小时,容量变化≤±0.5%,绝缘电阻≥10¹⁰Ω;
  • 老化特性:C0G无明显老化,长期使用容量稳定,无需额外降额。

六、选型与应用注意事项

  1. 电压降额:交流电路需按有效值降额(50V直流对应交流≤35V),避免介质击穿;
  2. PCB设计:焊盘符合IPC-7351,建议0.3mm×0.2mm,避免虚焊/立碑;
  3. 存储条件:未开封产品存于-10℃~+40℃、湿度≤60%,开封后12个月内使用;
  4. 环保合规:无铅外电极,符合RoHS、REACH,适配出口产品;
  5. 替代提示:若精度要求放宽(±10%),可考虑同封装X7R系列,但需注意温度漂移差异。

该产品兼顾小型化、高稳定性与可靠性,是高频精密电路的优选元件。

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