Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0201CG0R5B500NT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- FH 0201CG0R5B500NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201CG0R5B500NT
- Electronic Component
- 1
- Electronic Component
- 0.5pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0263677076
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0201CG0R5B500NT 贴片电容
一、产品定义
0201CG0R5B500NT是一款高性能的贴片电容（MLCC），其具备良好的电气特性和广泛的应用场景。它的容值为0.5pF，额定电压为50V，采用了C0G（NP0）温度系数材料，提供非常稳定的电容值和优异的温度特性。
二、基本参数
- 商品分类: 贴片电容（MLCC）
- 容值: 0.5pF
- 材质（温度系数）: C0G
- 额定电压: 50V
- 品牌: FH（风华）
- 封装: 0201
三、技术特性
小型化设计: 0201封装是贴片元器件中最小的封装之一，其尺寸为0.02英寸 x 0.01英寸（约0.6mm x 0.3mm），非常适合空间有限的电子电路，为高密度布局提供了可能性。
稳定性与可靠性: 采用C0G材料，0201CG0R5B500NT具有极好的温度稳定性，电容值对温度变化的敏感度非常低。它可以在广泛的工作温度范围内（通常为-55°C到125°C）稳定工作，不受环境变化的影响，保证了其在严苛条件下也能保持良好的性能。
低失真特性: 该型号电容具有非常低的等效串联损耗（ESR）和等效串联电感（ESL），使其在高频应用中表现出色，降低信号衰减与失真，适合高速度信号传输。
高额定电压: 额定电压为50V，使其在众多应用场景中都能够被安全使用，能够承受一定的电压波动，保护电路的安全。
四、应用场景
0201CG0R5B500NT因其独特的特性，广泛适用于以下领域：
- 射频（RF）应用: 由于其低ESR和低ESL特性，适合用于射频放大器、功率放大器等高频电路中。
- 信号处理: 在数据通信和其他高速信号处理电路中，0.5pF的容值能够提供良好的信号完整性和传输稳定性。
- 滤波电路: 可用于各种滤波器电路中，如低通、高通以及带阻滤波器，确保信号的质量。
- 时钟电路: 用于时钟发生器和时钟分频器中，以稳定时钟信号的频率。
- 医疗设备: 由于其高可靠性，适合用于对可靠性要求极高的医疗电子设备中。
五、总结
0201CG0R5B500NT作为一款高性能的贴片电容，凭借其小型化设计、稳定性和低丢失特性，在电子行业中具有重要的应用价值。尤其在高频和高密度布板的现代电子电路中，其重要性愈加凸显。无论是射频设备、信号处理，还是医疗设备，它均能提供优异的性能，并保证电路的稳定运行。无论是设计师还是设备制造商，都值得关注这款出色的贴片电容。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
