WMSIC Electronic Components

FH 0201CG100G500NT

Model0201CG100G500NT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0201CG100G500NT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0201CG100G500NT
Electronic Component
1
Electronic Component
10pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±2%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0265624867
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

风华FH 0201CG100G500NT多层陶瓷电容器产品概述

一、产品核心参数及型号解读

该产品型号为0201CG100G500NT,各字符对应意义明确:

  • 0201:英制封装代码,对应公制0603(长0.6mm×宽0.3mm),是小型化电子设备的主流微型封装;
  • C0G:温度系数标识(IEC标准),对应EIA NP0,为陶瓷电容中温度稳定性最优的介质类别;
  • 100:容值编码(前两位“10”为有效数,第三位“0”为倍率10⁰),即10pF;
  • G:精度代码,对应**±2%** 容值误差;
  • 500:额定电压编码(前两位“50”为有效数,第三位“0”为倍率10⁰),即50V DC;
  • NT:风华内部产品系列标识,代表常规高性能多层陶瓷电容器(MLCC)。

核心参数汇总如下:

参数类别 具体规格 品牌/型号 风华FH / 0201CG100G500NT 产品类型 多层陶瓷电容器(MLCC) 封装尺寸 0201(英制)/ 0603(公制) 容值/精度 10pF ±2% 温度系数 C0G(NP0) 额定电压(DC) 50V 损耗角正切 ≤0.15%(1kHz、25℃条件下) 工作温度范围 -55℃ ~ +125℃

二、关键性能特点

  1. 超稳定温度特性
    C0G介质的容值温度系数≤±30ppm/℃(即温度每变化1℃,容值变化≤0.003%),极端温度环境下(如-55℃低温或125℃高温),容值漂移可忽略,完全满足高精度电路对容值一致性的要求;
  2. 低损耗高Q值
    采用钛酸锶基低损耗介质,1kHz频率下损耗角正切(tanδ)≤0.15%,高频品质因数(Q值)较高,可有效减少信号衰减,提升振荡/滤波电路效率;
  3. 微型封装高密度
    0201(0603)封装尺寸极小(典型值:长0.5mm×宽0.3mm×厚0.25mm),适配智能手机、智能穿戴、小型通信模块等对尺寸要求苛刻的设备,助力产品轻薄化设计;
  4. 宽压适用高可靠
    50V额定直流电压覆盖大多数中低压电路(如3.3V、5V、12V系统),风华多层叠层工艺使内电极与陶瓷介质结合紧密,经严格可靠性测试,长期使用稳定性优异。

三、典型应用场景

该产品凭借稳定的温度特性、低损耗及微型封装,广泛应用于以下领域:

  1. 高频通信电路:WiFi、蓝牙、LoRa等无线模块的振荡电路(PLL锁相环)、滤波电路(低通/带通滤波),保障信号频率准确、传输损耗小;
  2. 精密模拟电路:运算放大器反馈电容、基准电压电路补偿电容、传感器信号调理电路,避免温度变化导致的电路性能漂移;
  3. 小型化消费电子:智能手机射频前端、TWS蓝牙耳机音频滤波、智能手表传感器接口,适配设备微型化需求;
  4. 工业/汽车电子:工业传感器模块信号滤波、汽车辅助驾驶小信号处理电路,-55℃~+125℃宽温范围可适应极端环境。

四、可靠性与环保合规

风华FH 0201CG100G500NT经多项可靠性测试,符合IEC及国内电子行业标准:

  • 温度循环测试:-55℃(30min)→+125℃(30min)循环1000次后,容值变化≤±0.5%,无击穿/开路;
  • 湿度老化测试:85℃/85%RH环境下放置1000h后,性能无明显衰减;
  • 耐电压测试:施加1.5倍额定电压(75V DC)保持1s,漏电流≤1μA,无击穿;
  • 环保合规:采用无铅外电极(Sn镀层),符合RoHS 2.0、REACH等法规,可用于出口及环保要求严格的产品。

五、使用注意事项

  1. 电压降额:实际工作电压建议不超过额定电压的80%(≤40V DC),避免长期满压工作导致性能衰减;
  2. 焊接工艺:无铅回流焊温度峰值≤260℃(峰值时间≤10s),手工焊接温度≤350℃(焊接时间≤3s),防止高温损坏介质层;
  3. 静电防护:MLCC对静电敏感(≥100V静电可能击穿),操作时需佩戴防静电手环,工作台接地;
  4. 存储条件:未开封产品存储于1535℃、4060%RH干燥环境,开封后建议1个月内使用完毕,避免受潮影响焊接性能;
  5. 无极性:C0G介质为无极性电容,安装时无需区分正负极。

该产品是风华针对高精度、高频、微型化应用推出的高性能MLCC,凭借稳定的温度特性、低损耗及可靠品质,成为消费电子、通信、工业等领域的优选元件。

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