Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0201CG1R0C500NT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- FH 0201CG1R0C500NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201CG1R0C500NT
- Electronic Component
- 1
- Electronic Component
- 1pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 50
- Electronic Component
- BM0264897116
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0201CG1R0C500NT 贴片电容 (MLCC)
在现代电子设计中，贴片电容（MLCC，Multi-Layer Ceramic Capacitor）因其小型化、高性能和高稳定性而广泛应用于各种电子设备中。0201CG1R0C500NT是风华（FH）品牌下的一款高品质贴片电容，具体参数为1pF、C0G材质，并且额定电压为50V，封装型式为0201。以下将详细介绍该产品的特性、应用及优势。
1. 产品规格
- 产品类型: 贴片电容（MLCC）
- 容量: 1pF
- 温度系数: C0G（NP0）
- 额定电压: 50V
- 封装: 0201
- 品牌: 风华 (FH)
2. 特性解析
- 容量与分辨率: 1pF的电容值使得该元器件在高频电路和精密信号传输中具备良好的精细控制能力，适用于射频（RF）及微波应用。
- 温度系数 (C0G): C0G电容说明该元器件具有良好的温度稳定性。其电容值在宽温范围内变化极小（约±30ppm/°C），适合对温度敏感的电路设计。
- 高额定电压: 最大额定电压为50V，确保在高电压环境下的安全性能。适用在需要对电压有明确要求的场合，如电源管理或信号处理电路。
- 0201 封装尺寸: 封装尺寸为0201（0.020英寸 x 0.010英寸），使得这一元件在PCB设计中占用极小空间，适合用于高密度电路板和便携式电子设备。
3. 应用领域
0201CG1R0C500NT 贴片电容的应用领域非常广泛，具体包括但不限于：
- 无线通信设备: 在射频电路中用作高频滤波和耦合电路，提升信号质量和传输效率。
- 消费电子: 如智能手机、平板电脑和其他小型电子设备，适用于信号稳压、滤波等多个环节。
- 医疗仪器: 在高精度仪器中使用，以保证电路的可靠性和稳定性，尤其是在变化大的环境中。
- 汽车电子: 车载系统中需处理高频信号的装置，如雷达和传感器，使用更高要求的电容可以提高系统的可靠性与响应时间。
4. 优势分析
- 高性能: 采用C0G材料的电容器在频率响应和ESR（等效串联电阻）方面表现优异，不仅降低信号失真，还能提升电路的工作效率。
- 稳定性与可靠性: C0G电容的温度特性提供卓越的稳定性，适合各种应用环境，从而避免因温度变化造成电路性能的波动。
- 体积小巧: 0201封装使其在现代小型电子产品设计中具有突出的优势，符合当今用户对轻薄短小设备的需求。
5. 结论
0201CG1R0C500NT贴片电容以其卓越的性能、小巧的封装和广泛的应用范围，成为现代电子设计中不可或缺的组件之一。无论是在高频无线通信、消费电子，还是在医疗和汽车电子领域，均显示出其强大的适应性和高可靠性。对于需要高精度、高稳定性和小尺寸解决方案的设计者而言，这款电容无疑是一个理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
