WMSIC Electronic Components

FH RC-02K3162FT

ModelRC-02K3162FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K3162FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K3162FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.022g
Electronic Component
31.6kΩ
Electronic Component
50
Electronic Component
BM0257367114
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FH风华RC-02K3162FT 厚膜贴片电阻产品概述

FH风华RC-02K3162FT是一款针对高密度电路设计的工业级厚膜贴片电阻,采用0402紧凑封装,兼具精准阻值、宽温适应性与稳定可靠性,适用于消费电子、工业控制等多场景的常规电路需求。

一、产品核心参数与规格

RC-02K3162FT的关键参数严格遵循工业标准,具体如下:

  • 电阻类型:厚膜贴片电阻(陶瓷基底+厚膜浆料烧结工艺)
  • 阻值与精度:31.6kΩ,精度±1%(满足大多数电路误差要求)
  • 功率额定值:62.5mW(0.0625W),适配低功耗电路
  • 最大工作电压:50V,兼容12V~48V常见电压场景
  • 温度系数(TCR):±100ppm/℃,温度变化时阻值漂移可控
  • 工作温度范围:-55℃至+155℃,覆盖工业级环境温度
  • 封装尺寸:0402(英制0.04"×0.02",公制1.0mm×0.5mm),适合高密度PCB布局
  • 品牌:风华电子(FH),国内老牌电子元件制造商

二、封装与结构特点

  1. 紧凑封装适配小型化:0402封装是当前主流小尺寸贴片之一,可减少PCB占用面积60%以上,适合智能手机、可穿戴设备等对体积敏感的产品;
  2. 厚膜工艺稳定可靠:采用氧化铝陶瓷基底印刷厚膜电阻浆料,经高温烧结形成电阻层,兼具成本优势与性能稳定性——比薄膜电阻成本低30%左右,比碳膜电阻精度高2倍;
  3. 电极设计优化焊接:两端电极采用镍-锡合金工艺,可兼容回流焊、波峰焊等常规贴片焊接方式,焊接缺陷率低于0.1%。

三、性能优势解析

  1. 精度与温漂平衡:±1%精度可满足85%以上常规电路(如信号分压、滤波、限流),无需额外校准;±100ppm/℃的TCR在-55℃~+155℃范围内,阻值最大漂移约±2.1%(210℃温差×100ppm),符合工业级应用的漂移要求;
  2. 功率与电压兼容性:62.5mW额定功率支持MCU I/O口限流、传感器信号调理等低功耗场景;50V最大电压可覆盖12V~48V的工业电压,避免电压击穿风险;
  3. 宽温适应性:-55℃低温下无阻值突变,+155℃高温下无性能衰减,可满足户外设备、汽车辅助电路等 harsh环境;
  4. 批量可靠性:风华成熟的厚膜工艺确保产品一致性,批量生产时阻值离散度≤0.5%,适合大规模工业化应用。

四、典型应用场景

  1. 消费电子小型化设备:智能手机、智能手表的电源滤波电路、音频信号分压电路;
  2. 工业控制模块:小型传感器节点(温度、压力传感器)的信号调理电路、PLC的I/O接口限流;
  3. 汽车电子辅助电路:仪表盘背光调节电路、车载传感器信号滤波(需汽车级认证时可选用衍生型号);
  4. 通信设备:小型无线模块(蓝牙、WiFi)的射频周边电阻、电源管理电路;
  5. 医疗便携设备:便携式血糖仪、血压计的信号放大电路、显示驱动电路。

五、选型与使用注意事项

  1. 功率降额使用:实际工作功率建议不超过额定功率的80%(≤50mW),避免长期过载导致阻值漂移或失效;
  2. 焊接工艺规范:回流焊温度峰值≤260℃,焊接时间≤10秒;波峰焊温度≤245℃,时间≤3秒,防止热损伤电阻层;
  3. 环境防护建议:若应用于腐蚀性气体环境(硫化物、氯气),可选用带环氧树脂涂层的衍生型号,增强抗腐蚀能力;
  4. 库存与供应:该型号为风华常规量产型号,供应稳定,可支持100~100k+的订单需求。

RC-02K3162FT凭借其小封装、宽温、稳定可靠的特点,成为工业与消费电子领域常规电路设计的优选厚膜贴片电阻之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.