WMSIC Electronic Components

FH 0402CG2R0B500NT

Model0402CG2R0B500NT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
FH 0402CG2R0B500NT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0402CG2R0B500NT
Electronic Component
1
Electronic Component
2pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0264897110
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

风华FH 0402CG2R0B500NT 贴片陶瓷电容(MLCC)产品概述

一、产品核心定位与身份

该电容是风华电子(FH) 推出的多层陶瓷贴片电容(MLCC),型号为0402CG2R0B500NT,属于Class I高精度陶瓷电容系列。其核心定位是满足小尺寸、高温度稳定性、低损耗的电路设计需求,是0402封装规格下针对高频/高精度场景的典型应用电容。

二、关键电性能参数

该电容的核心电性能可归纳为以下5项:

  1. 容值与公差:标称容值为2pF,容值公差符合风华标准,典型为**±1%(F档)**(Class I电容常用公差,满足高精度电路需求);
  2. 额定电压:直流额定电压为50V,可覆盖中低压电路的耐压要求(如12V/24V系统的冗余设计);
  3. 温度系数:采用C0G(NP0) 陶瓷材料,温度系数≤±30ppm/℃(在-55℃~+125℃宽温范围内),容值随温度变化极小;
  4. 损耗特性:1kHz测试条件下,损耗角正切(tanδ)≤0.15%,高频损耗低,适合射频(RF)电路的信号传输;
  5. 绝缘性能:25℃、10V直流条件下,绝缘电阻典型值≥10^12 Ω,抗漏电能力优异。

三、封装与物理特性

  1. 封装规格:采用0402英制封装(对应公制1005封装),实际尺寸为长1.0mm×宽0.5mm×厚0.5mm(小容值2pF的典型厚度,适配高密度PCB设计);
  2. 端电极设计:无铅端电极(符合RoHS 2.0标准),电极结构为“镍层+锡层+抗氧化层”三层设计,确保焊接可靠性与抗硫化性能;
  3. 贴装兼容性:适配常规SMT贴片机,可实现高速贴装(速度≥10000片/小时),适合自动化量产。

四、材料与温度稳定性优势

作为Class I陶瓷电容,C0G材料是该产品的核心竞争力:

  • 宽温稳定性:在-55℃~+125℃范围内,容值变化率≤±0.06pF(2pF×30ppm/℃×180℃温差),远优于Class II电容(如X7R的±15%容值变化);
  • 电压稳定性:容值随直流偏置电压变化极小(≤0.1% at 50V),避免电压波动导致的电路性能漂移;
  • 老化特性:无明显容值老化现象(Class I电容老化率通常≤0.1%/decade),长期使用可靠性高。

五、典型应用场景

结合电性能与封装特点,该电容适用于以下场景:

  1. 高频振荡电路:晶振负载电容、PLL(锁相环)电路等,需稳定容值保证频率精度;
  2. 射频(RF)匹配网络:手机、蓝牙耳机、WiFi模块的RF前端,低损耗减少信号衰减;
  3. 汽车电子敏感电路:车载通信、传感器信号处理,宽温范围满足-40℃~+85℃的车载环境;
  4. 工业控制高精度电路:PLC、传感器接口等,对容值稳定性要求严苛的模块;
  5. 小型化消费电子:智能手表、TWS耳机等高密度PCB设计,0402封装节省空间。

六、品牌可靠性与合规性

风华FH作为国内MLCC龙头厂商,该产品具备以下保障:

  1. 标准合规:符合IEC 60384-1、JIS C 5101等国际标准,通过UL、RoHS 2.0、REACH认证;
  2. 可靠性测试:经过温度循环(-55℃~+125℃,1000次)、湿度加载(85℃/85%RH,1000h)、振动(10~2000Hz,2g加速度) 等测试,满足工业级要求;
  3. 供应链稳定:风华拥有完整MLCC生产线,产能稳定,可提供批量供货与定制化服务(如特殊公差、包装要求)。

该电容以小尺寸、高稳定、低损耗的特点,成为高频/高精度电路设计的可靠选择,适配从消费电子到工业/汽车电子的多场景需求。

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