Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH ABD03K1000FT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH ABD03K1000FT
- Type
- FH
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- ABD03K1000FT
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 100Ω
- Electronic Component
- 10
- Electronic Component
- BM0228059479
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ABD03K1000FT 产品概述
一、产品简介
ABD03K1000FT 为风华（FH）系列厚膜贴片电阻，封装为 0603（1608 英制）。标称阻值 100Ω，公差 ±1%，额定功率 100mW，最大工作电压 75V，温度系数（TCR）±100ppm/℃，工作温度范围 -55℃ 至 +155℃。该产品针对车规应用设计，满足 AEC‑Q200 相关条款要求。
二、主要特性
- 符合汽车电子可靠性要求（AEC‑Q200 相关条款）。
- 小体积、重量轻，适合空间受限的车载系统布局。
- 可兼容回流焊与波峰焊工艺，装配灵活。
- 电性能稳定，长期漂移小、噪声低，可靠性高。
- 与自动贴装设备匹配，降低装配成本并提升生产效率。
- 机械强度高，适应振动与冲击环境；高频特性优越，适合高速信号路径使用。
三、电气与环境参数
- 阻值：100Ω；公差：±1%。
- 额定功率：100mW；最大工作电压：75V。
- TCR：±100ppm/℃，适合对温漂有一定要求的电路。
- 工作温度：-55℃ ~ +155℃，满足汽车级温度循环与高温工作需求。
四、可靠性与标准
ABD03K1000FT 按照 AEC‑Q200 要求设计并通过相关验证，适配汽车信息娱乐、车载导航等对长期可靠性有较高要求的系统。器件在封装与材料上采用稳健方案，以确保在热循环、湿热、振动和冲击等环境下的稳定性。
五、典型应用
- 汽车信息系统、车载导航主板中的分压、终端与偏置网络。
- 汽车通信模块与传感器接口电路。
- 高频信号匹配与阻抗终端场合，及对体积和可靠性有较高要求的一般电子线路。
六、封装与贴装建议
0603 封装适用于常规贴片工艺，建议采用标准卷带包装，配合自动贴片机高速贴装。推荐使用符合无铅回流焊曲线的焊膏与工艺参数，并在换线或长期储存时注意防潮防静电处理，以维持器件性能与可靠性。
如需更多规格细节、样品或可靠性试验数据（如寿命、温度循环、湿热测试结果等），可联系供应商技术支持以获取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
