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FH 0402CG3R9C500NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- FH 0402CG3R9C500NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402CG3R9C500NT
- Electronic Component
- 1
- Electronic Component
- 3.9pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0257283212
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402CG3R9C500NT 产品概述
一、产品简介
0402CG3R9C500NT 为风华(FH)贴片多层陶瓷电容（MLCC），标称电容值 3.9 pF，额定电压 50 V，温度系数 C0G（等同于 NP0），封装尺寸 0402（公制 1005）。C0G 为一类介质，温度稳定性好、介电常数随温度变化极小，适合对精度和频率响应要求高的电路。
二、主要特性
- 温度稳定：C0G 温度系数接近 0，典型温漂很小（ppm 级），长期稳定性优良。
- 低损耗、高 Q 值：介质损耗低，适合射频和高频信号路径。
- 频率响应平直：在 MHz~GHz 范围内保持较一致的阻抗特性，适合滤波与谐振用途。
- 小封装：0402 占板面积小，适用于高密度 SMT 布局与便携式电子产品。
三、典型应用场景
适用于射频前端、谐振回路、振荡器与时钟电路、精密滤波网络、阻容匹配和高频耦合/旁路。由于电容值较小，不适合作为主力去耦（bulk decoupling），更多用于频率选择与精密电路。
四、装配与使用建议
- 推荐使用符合 IPC 标准的焊盘与回流工艺，遵循厂家推荐的焊接温度曲线（无铅回流峰值常见为 245–260°C，具体按生产批次数据为准）。
- 避免在元件两端施加过大机械应力，贴片在 PCB 弯曲或螺钉紧固附近可能导致裂纹或失效，布线时尽量将器件远离板边和弯折区。
- 设计 PCB 走线与焊盘时参考厂家陆法图（land pattern）或 IPC-7351 指南，以保证焊点可靠性与可重复贴装性。
- 虽然 C0G 对直流偏压敏感度较小，但在特殊高频或精密测量场合，仍建议在样机上进行在位测量验证实际电容变化。
五、可靠性与储存
保持原包装（干燥卷带）存放于干燥、阴凉处，避免潮湿和强光直射。长期暴露于高湿环境后，建议在回流前根据吸湿情况适当烘烤以排除吸湿。常见失效模式包括机械裂纹、焊接不良与热循环引起的性能漂移，合理的 PCB 设计与焊接工艺可显著降低风险。
六、检验与替代建议
出厂常见检验项目为外观、尺寸、LCR 参数及耐压测试。工程验证时可用 LCR 表或网络分析仪检测电容、ESR 与频率响应。若需替代，可在同等封装、同温度系数（C0G/NP0）、相近电压与电容值下选择其他品牌或同厂系列，注意比对频率特性与可靠性数据。
七、采购信息与包装
风华 0402CG3R9C500NT 通常以卷带（tape & reel）方式供货，支持表面贴装自动化生产。订购时建议确认 RoHS 合规、批次号与出厂检验报告，以便生产追溯与质量控制。
总结：0402CG3R9C500NT 以其 C0G 的稳定特性和 0402 的小型化，适合对温漂、损耗和频率响应有严格要求的高频及精密电路，是射频前端、振荡及滤波电路中常用的标准元件。
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