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FH 0805X106K250NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- FH 0805X106K250NT
- Type
- FH
- Minimum package
- 2000
Technical parameters
- Electronic Component
- FH
- Electronic Component
- 0805X106K250NT
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0218493118
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0805X106K250NT 贴片电容
一、基本信息
产品名称：0805X106K250NT
元件类型：贴片电容（多层陶瓷电容 MLCC）
封装型号：SMD 0805
电容量：10µF
额定电压：25V
容差：±10%
材料：X5R
品牌：FH（风华）
二、产品介绍
0805X106K250NT 是一种表面贴装（SMD）多层陶瓷电容（MLCC），其封装规格为0805。这款电容具有 10µF 的电容量，额定电压为 25V，采用 X5R 材料，不仅适合于各种通用应用，还能够在较宽温度范围内保持良好的电特性。
三、技术规格与特性
电容量与电压
该电容的电容量为10µF，能够支持多种电路需求，尤其是在滤波、去耦和储能等应用中。同时，25V 的额定电压确保它能够在多种工作电压条件下可靠运行。容差
容差 ±10% 表示该电容的实际电容量在 9µF 到 11µF 之间波动，具有一定的灵活性，能够适应不同的电路设计要求。温度特性
X5R 作为一种温度特性，适合于 -55℃ 至 +85℃ 的工作环境，并能够承受相对的高湿性。该特性的优势在于即使在温度波动下，电容值的变化相对较小，这使得它在要求稳定性的应用中表现出色。封装尺寸
0805 封装尺寸为 0.08英寸 × 0.05英寸（约 2.0mm × 1.25mm），在现代电子设备中占用空间小而不影响电路性能，适合高密度电路设计。低ESR和高频特性
该电容在工作频率较高的情况下具有低等效串联电阻（ESR），使其在高频应用（如 RF和高频开关电源）中表现良好。
四、应用场景
0805X106K250NT 贴片电容凭借其优良的性能和广泛的适用性，可以广泛应用于：
消费电子产品
包括手机、平板电脑、笔记本电脑以及其他便携式设备中，用于电源去耦和信号滤波。工业设备
在工业控制系统中，作为电源稳定性和电磁干扰（EMI）抑制的组件。汽车电子
适合于汽车电子系统中，为传感器、控制模块提供稳定的电源支持。通信设备
用于基站和通信设备中，提供功率滤波和时钟电路的去耦。医疗设备
在医疗仪器中，用以确保稳定性和可靠性，尤其是在对安全和精度要求非常高的应用中。
五、总结
0805X106K250NT 贴片电容以其高质量、高可靠性和广泛的适用场景，成为电子设计工程师的优先选择。无论是在消费电子、工业控制，还是汽车和医疗设备中，它都能提供出色的性能和稳定性。随着电子产品向更小型化和高性能化发展，0805X106K250NT 将继续在未来的电子设计中发挥重要的作用。通过利用其优越的电气特性和可靠的应用性能，设计师可以更好地满足市场对高集成度和高性能电子产品日益增长的需求。
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