WMSIC Electronic Components

FH CBM100505U221T

ModelCBM100505U221T
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH CBM100505U221T
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
CBM100505U221T
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.022g
Electronic Component
1
Channel Count
1
Electronic Component
BM0265116712
Operating Temperature
55℃~+125℃
@Frequency
220Ω@100MHz
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CBM100505U221T 片式磁珠产品概述

一、产品核心定位与应用场景

CBM100505U221T是风华电子(FH)推出的高频干扰抑制型片式磁珠,核心作用是通过在特定频率下呈现高阻抗,吸收或抑制电子电路中的电磁噪声,保障电路的电磁兼容性(EMC)。该产品针对100MHz频段干扰优化,结合宽温工作能力、低损耗特性及小型化封装,适用于消费电子、汽车电子、工业控制等多领域,尤其适合对尺寸、功耗及温度适应性有严格要求的中小型电路设计。

二、关键技术参数深度解析

磁珠性能的核心体现在阻抗-频率特性、直流损耗及环境适应性,以下是该产品的关键参数解读:

2.1 核心阻抗特性

标称阻抗为220Ω@100MHz,误差±25%。磁珠阻抗随频率变化:100MHz频段下220Ω的阻抗可有效吸收该频段噪声(如数字电路高频谐波、射频杂散信号);低频段(直流至几十MHz)阻抗低,主要起直流导通作用;高频段(超100MHz)阻抗先升后降,需根据实际干扰频段匹配。

2.2 直流损耗与额定电流

  • 直流电阻(DCR):300mΩ:直流下电阻值,直接影响功耗。600mA电流下功耗仅(0.6A×0.6A×0.3Ω=0.108W),发热极小,不影响电路效率。
  • 额定电流:600mA:允许通过的最大直流电流,超此值磁芯饱和,阻抗骤降,失去干扰抑制能力甚至损坏。

2.3 环境与封装特性

  • 工作温度:-55℃~+125℃:覆盖工业级(-4085℃)、汽车级(-40125℃)要求,适配极端环境(如汽车发动机舱、户外工业传感器)。
  • 封装:0402(公制1005):尺寸约1.0mm×0.5mm,兼容高密度PCB布局,满足便携式设备(手机、智能手表)小型化需求。
  • 通道数:1:单通道设计,可直接串入信号/电源线路,安装简单。

三、产品优势与设计价值

相比同类产品,该磁珠的核心优势在于:

3.1 宽温稳定,适配严苛场景

-55~125℃无额外散热/补偿,直接应用于汽车、工业领域,降低系统设计复杂度。

3.2 低损耗,提升电路效率

300mΩ DCR远低于同类平均水平,中等电流下(300~600mA)几乎不影响直流压降,适合电池供电设备延长续航。

3.3 针对性高频干扰抑制

精准抑制100MHz附近谐波(如CPU时钟二次谐波),帮助产品快速通过EMC认证,减少后期整改成本。

3.4 小型化封装,节省布局空间

0402封装与同类元件兼容,提升PCB集成度,适合无线耳机、汽车ECU等高密度设计。

3.5 品牌可靠性,一致性好

风华电子产品经高低温循环、湿热老化等测试,参数一致性高,降低批量生产不良率。

四、典型应用领域

结合参数特性,典型应用包括:

  1. 汽车电子:车载中控、胎压监测(TPMS)、ECU电源滤波;
  2. 消费电子:智能手机主板、智能手表心率传感器、蓝牙耳机射频模块;
  3. 工业控制:PLC I/O模块、工业传感器节点、小型工业电源;
  4. 通信设备:小型4G/5G基站、家用路由器无线滤波;
  5. 医疗电子:便携式血糖检测仪、小型监护仪信号抑制。

五、使用注意事项

  1. 电流限制:实际电流≤600mA,超额定值需换高电流磁珠;
  2. 频率匹配:100MHz以外干扰需选对应阻抗-频率特性型号;
  3. 焊接工艺:回流焊温度≤260℃(峰值),时间≤10秒,避免热损伤;
  4. 环保合规:符合RoHS 2.0、REACH,无铅无卤,满足出口要求。

六、总结

CBM100505U221T凭借宽温适应性、低损耗、针对性高频抑制及小型化封装,成为多领域EMC设计优选。无论是消费电子小型化需求,还是汽车/工业严苛环境,均能提供稳定可靠的干扰抑制效果,简化设计流程,提升产品竞争力。

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