WMSIC Electronic Components

FH RC-02K5112FT

ModelRC-02K5112FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
FH RC-02K5112FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K5112FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
0.022g
Electronic Component
10
Electronic Component
BM0265737751
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-02K5112FT 厚膜贴片电阻产品概述

一、产品基本定位与品牌背景

RC-02K5112FT是国内电子元器件龙头厂商风华高科(FH品牌) 推出的一款厚膜贴片电阻,属于常规精度、中温系数的标准化器件。该型号针对高密度PCB设计优化,采用0402小封装,核心面向消费电子、工业控制、汽车电子等领域的中低功率电路,兼顾成本控制与基础性能需求。

风华高科作为国内电阻行业标杆,其厚膜电阻产品以工艺成熟、质量一致性高著称——RC-02K5112FT延续了品牌的量产稳定性优势,适合大规模标准化电路设计,无需额外定制即可满足多数通用场景需求。

二、核心参数详细解析

该型号的关键参数直接决定了其适用场景,具体解析如下:

1. 阻值与精度

  • 标称阻值:51.1kΩ(阻值代码“5112”对应“51×10²Ω”);
  • 精度等级:±1%,满足信号分压、限流、反馈网络等场景的基本误差要求(无需高精度应用的额外成本)。

2. 功率与散热

  • 额定功率:62.5mW(0402封装的典型功率规格);
  • 注意:实际使用需遵循降额原则(环境温度升高时功率容量下降,如125℃时建议降额至50%以下)。

3. 温度系数(TCR)

  • 参数:±100ppm/℃,即温度每变化1℃,阻值变化±0.01%;
  • 示例:环境温度从25℃升至155℃(变化130℃),阻值最大漂移±0.13%,适合温度波动较小的稳定场景。

4. 工作温度范围

  • 范围:-55℃~+155℃,覆盖工业级与汽车级宽温需求(如汽车发动机舱、户外工业设备),远优于普通消费级电阻(通常仅-40~85℃)。

5. 工艺类型

  • 厚膜电阻:通过丝网印刷、高温烧结制备,成本低于薄膜电阻,抗冲击能力强,适合量产。

三、封装特性与适用场景

1. 封装规格

采用0402封装(英制:0.04″×0.02″,公制:1.0mm×0.5mm),是贴片电阻中小尺寸规格之一,适配高密度PCB设计(如智能手机、智能手表的小型模块)。

2. 典型应用场景

  • 消费电子:手机音频电路分压、平板电池管理限流;
  • 工业控制:PLC输入模块信号调理、小型传感器信号匹配;
  • 汽车电子:车载中控LED指示灯限流、车身传感器信号分压;
  • 通信设备:路由器/交换机中低频信号匹配;
  • 智能家居:智能音箱、门锁控制电路电阻。

四、性能优势与可靠性表现

  1. 成本与量产优势:厚膜工艺成熟,生产效率高,单位成本低于薄膜电阻,适合大规模标准化生产;
  2. 长期稳定性:抗老化能力优于碳膜电阻,额定参数内使用可保证3~5年阻值无明显漂移;
  3. 宽温适应性:-55~155℃覆盖多数恶劣环境,无需额外散热设计(功率降额前提下);
  4. 贴装兼容性:0402封装适配主流SMT生产线,贴装精度要求适中,废品率低。

五、使用与选型注意事项

  1. 功率降额:

    • 25℃环境:可满功率62.5mW;
    • 70℃以上:降额至80%(≤50mW);
    • 125℃以上:降额至50%(≤31.25mW);
    • 禁止连续满功率运行,需预留20%以上安全余量。
  2. 精度与TCR匹配:

    • 若需±0.1%精度(如医疗设备),需换薄膜电阻;
    • 若环境温度波动≥±100℃,需选TCR≤50ppm/℃的低漂移电阻。
  3. 焊接工艺:

    • 回流焊峰值温度≤245℃,时间≤10秒;
    • 避免手工焊接时过热(烙铁温度≤350℃,时间≤3秒)。
  4. 静电防护:

    • 虽抗静电能力优于半导体,但需用防静电工作台/手环,避免直接接触引脚。

总结

RC-02K5112FT作为风华高科的常规厚膜贴片电阻,以高性价比、宽温适应性、稳定可靠性成为中低功率电子电路的优选器件,适合多数标准化应用场景的设计需求,无需额外定制即可满足多数通用电路的性能要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.