WMSIC Electronic Components

FH RC-02K1651FT

ModelRC-02K1651FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K1651FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K1651FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.022g
Electronic Component
1.65kΩ
Electronic Component
10
Electronic Component
BM0265624864
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-02K1651FT 贴片厚膜电阻产品概述

一、产品基本信息

RC-02K1651FT是风华(FH)品牌推出的0402封装贴片厚膜电阻,属于通用型高精度电阻器件。该产品采用厚膜工艺制造,核心定位为电子电路中的阻抗匹配、分压、限流、滤波等基础功能,兼具小体积、高精度、宽温稳定等特点,适配消费电子、工业控制、通信等多领域应用需求。

二、核心参数详解

该产品的关键参数可满足大多数通用电路的设计要求,具体如下:

  1. 阻值与精度:标称阻值1.65kΩ(1650Ω),精度等级±1%,可避免因阻值偏差导致的信号失真或功能异常;
  2. 功率等级:额定功率62.5mW,属于0402封装电阻的典型规格,最大允许电流约6.1mA(计算:(I=\sqrt{P/R}=\sqrt{0.0625/1650}));
  3. 工作电压:最大连续工作电压50V,脉冲电压需参考风华官方 datasheet(禁止超压连续工作);
  4. 温度特性:温度系数±100ppm/℃(温度每变1℃,阻值变化0.01%),工作温度范围覆盖-55℃至+155℃,可适应极端环境;
  5. 封装尺寸:英制0402封装(对应公制1005),尺寸1.0mm×0.5mm,适合高密度PCB布局。

三、工艺与材料特性

该产品基于厚膜丝网印刷工艺制造,核心材料与工艺特点保障了性能稳定:

  1. 基片:高纯度氧化铝陶瓷基片,绝缘性优异、热膨胀系数低,降低温度对阻值的影响;
  2. 电阻膜层:钌基厚膜浆料经高温烧结形成致密层,具备低温度系数、高稳定性;
  3. 电极:两端银钯合金电极,焊接性好、抗氧化,适配回流焊/波峰焊;
  4. 保护层:环氧树脂涂层,防潮、防机械损伤,提升长期可靠性。

四、典型应用场景

凭借小体积、高精度、宽温稳定的特性,该产品广泛应用于:

  1. 消费电子:智能手机、平板、智能穿戴的信号调理电路(传感器分压、按键限流);
  2. 工业控制:PLC、工业传感器接口电路,宽温适应车间高低温环境;
  3. 通信设备:基站、路由器射频前端阻抗匹配,±1%精度满足信号传输要求;
  4. 电源电路:小功率DC-DC转换器反馈分压网络,62.5mW功率适配低功耗场景;
  5. 汽车电子:车载信息娱乐系统、胎压监测模块辅助电路(需结合车规验证)。

五、性能优势梳理

  1. 高精度适配:±1%精度覆盖90%以上通用电路需求,无需额外校准;
  2. 宽温稳定可靠:±100ppm/℃温度系数+ -55~155℃宽温,极端环境下阻值波动小;
  3. 小体积高密度:0402封装节省PCB空间,适配便携设备与高密度设计;
  4. 高可靠性:陶瓷基片+厚膜工艺+环氧树脂保护层,抗老化、抗潮湿;
  5. 品牌品质保障:风华作为国内被动元件龙头,生产工艺成熟,产品一致性好。

六、使用注意事项

  1. 功率余量:实际功耗需低于62.5mW,建议留30%以上余量(如电流≤4.2mA),避免过热漂移;
  2. 电压限制:连续电压≤50V,脉冲电压参考 datasheet(通常≤100V);
  3. 焊接工艺:遵循回流焊曲线(预热150-180℃/60-120s,峰值230-250℃/10-20s),避免热冲击;
  4. 存储条件:常温(25±5℃)、干燥(湿度≤60%)环境,避免高湿/高盐雾;
  5. 精度升级:若需±0.1%超精密,需更换薄膜电阻,本产品不满足。

该产品平衡了精度、体积与可靠性,是通用电子电路的高性价比选择。

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